ATS-13C-10-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.87°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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The ATS-13C-10-C1-R0 thermal heat sink and its application field and working principle Heat sinks are widely used in the electronics industry to dissipate large amounts of heat generated by the electronic components. The ATS-13C-10-C1-R0 thermal heat sink is one such technology which is used to effectively dissipate unwanted heat generated on a set of electronic components. This article will provide a brief overview of the design of this heat sink and look at its application field and working principles.The ATS-13C-10-C1-R0 thermal heat sink is a finned heat sink, which is designed to provide efficient heat transfer from electronic components to the surrounding air. This achieves this by forcing air to pass over the fins, which increases the rate at which heat can be dissipated. The ATS-13C-10-C1-R0 thermal heat sink is constructed of lightweight aluminum alloy material and is machined to a high tolerance in order to maximise the heat dissipation capability of the device. The ATS-13C-10-C1-R0 heat sink has a wide range of applications, as it is able to transfer heat away from a variety of components, including CPUs, GPUs, memory chips, power supplies and CPUs. This makes it suitable for use in computers, gaming consoles, cell phones, home automation systems, and a wide range of other electronic devices. The working principle of the ATS-13C-10-C1-R0 thermal heat sink is simple yet effective. Heat generated from electronic components is transferred to the fins of the heat sink by conduction. The fins then act as a heatsink, dissipating the heat through natural convection. Air is forced to flow over the fins, increasing the rate at which heat can be dissipated from the fins to the surrounding atmosphere.The ATS-13C-10-C1-R0 thermal heat sink is a reliable and efficient way of transferring and dissipating heat generated by electronic components. The heat sink’s lightweight alloy construction, high tolerance machining, and efficient thermal dissipation make it suitable for use in a wide range of applications. With its ability to easily dissipate large amounts of heat, the ATS-13C-10-C1-R0 thermal heat sink is an essential technology for modern electronic devices.

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