
Allicdata Part #: | ATS-13C-11-C3-R0-ND |
Manufacturer Part#: |
ATS-13C-11-C3-R0 |
Price: | $ 3.83 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 50X50X10MM XCUT T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.48138 |
30 +: | $ 3.28818 |
50 +: | $ 3.09481 |
100 +: | $ 2.90134 |
250 +: | $ 2.70791 |
500 +: | $ 2.51449 |
1000 +: | $ 2.46614 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.969" (50.00mm) |
Width: | 1.969" (50.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.394" (10.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 18.86°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are essential components in electronic and electrical devices. As their name implies, they help to dissipate heat produced by electronics. The ATS-13C-11-C3-R0 is a highly efficient thermal-heat sink with a variety of applications and operating principles.
The ATS-13C-11-C3-R0 is designed to address the problem of overheating due to the generation of significant amounts of waste heat generated by electrical components. The sink uses a combination of air and thermal conduction to dissipate heat from electronic components. The device uses a combination of convection and radiative cooling to quickly and effectively dissipate waste heat from a variety of sources. The sink is also designed to optimize air flow, ensuring that components are adequately cooled even in confined areas.
The ATS-13C-11-C3-R0 is designed to be used in a variety of applications, including power supplies, LED lighting, computers and server systems. The sink can also be used in automotive applications such as electric cars and hybrids, where the high ambient temperatures in an enclosed environment require effective and efficient cooling solutions. The sink is also suited for use in industrial, military, and medical applications, where superior cooling performance is essential.
The ATS-13C-11-C3-R0 utilises a number of innovative features to deliver superior cooling performance. The device features high performance graphite base and a large aluminum fin array. The aluminum fins are designed to maximise surface area, allowing for more efficient heat transfer. The innovative thermal resistance design of the device ensures that heat is dissipated quickly and evenly.
Another important feature of the ATS-13C-11-C3-R0 is its ability to be easily integrated into various systems. The device features a selection of mounting options that allow for easy installation in nearly any environment. The flexible design of the device also means that it can be tailored to various applications and can be adapted to fit custom requirements. The device can be equipped with a variety of fans and accessories that can help to further enhance its performance.
The ATS-13C-11-C3-R0 is a highly efficient and versatile heat sink designed to address a number of thermal management problems. The device offers superior heat dissipation performance, while being able to fit into a variety of environments. Its flexibility and easy installation make it an ideal choice for a number of different applications, from automotive to industrial. With its combination of features and reliable performance, the ATS-13C-11-C3-R0 is an essential part of any thermal management solution.
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