| Allicdata Part #: | ATS22076-ND |
| Manufacturer Part#: |
ATS-13C-12-C2-R0 |
| Price: | $ 4.16 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13C-12-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.78000 |
| 10 +: | $ 3.67794 |
| 25 +: | $ 3.47382 |
| 50 +: | $ 3.26957 |
| 100 +: | $ 3.06520 |
| 250 +: | $ 2.86086 |
| 500 +: | $ 2.65651 |
| 1000 +: | $ 2.60542 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.86°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential for the optimal functioning of many electronic devices. Heat sinks, like the ATS-13C-12-C2-R0, are specifically designed to dissipate heat generated by electronic components to ensure that they do not overheat and become damaged. The ATS-13C-12-C2-R0 is a highly efficient, single-finned heat sink with a low-profile design suitable for applications that require minimal space. It is made from extruded aluminum and has a surface area of 37.5 cm2.
The ATS-13C-12-C2-R0 features a heat sink base plate onto which multiple fins are attached. These fins act as radiators, allowing the heat to dissipate into the surrounding atmosphere. The fins are separated from the base plate with an insulating barrier, ensuring that the heat is not transferred back to the device itself. The internal structure of the fins also helps to create turbulent airflows, which further accelerates the process of heat dissipation. Additionally, the anodized surface of the ATS-13C-12-C2-R0 increases its thermal conductivity.
The ATS-13C-12-C2-R0 is ideal for a variety of applications that require a highly efficient heat sink. It is designed to dissipate heat more quickly than competing models with larger profiles, making it suitable for many small, high-performance electronic devices. Furthermore, its low profile design allows it to fit into tight spaces, such as inside laptop computers or embedded systems. The ATS-13C-12-C2-R0 is also popularly used in industrial controllers, power converters, LEDs, and other power electronics.
In summary, the ATS-13C-12-C2-R0 is an ideal solution for efficient heat dissipation in small, high-performance applications. Its low-profile design ensures minimal impact on the device\'s overall dimensions, allowing it to fit into tight spaces. Additionally, its fin structure boosts the rate of heat dissipation and its anodized surface finish increases its thermal conductivity. As a result, the ATS-13C-12-C2-R0 is an ideal choice for industrial controllers, power converters, LEDs, and other power electronics.
The specific data is subject to PDF, and the above content is for reference