ATS-13C-128-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-13C-128-C1-R0-ND

Manufacturer Part#:

ATS-13C-128-C1-R0

Price: $ 3.75
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13C-128-C1-R0 datasheetATS-13C-128-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.41208
30 +: $ 3.31968
50 +: $ 3.13526
100 +: $ 2.95079
250 +: $ 2.76641
500 +: $ 2.67419
1000 +: $ 2.39754
Stock 1000Can Ship Immediately
$ 3.75
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.90°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-13C-128-C1-R0 is a radial finned heat sinks designed for high power applications. It is designed for optimal heat dissipation with aluminum construction, fins, and a die-cast metal base.

The heat sink has an anodized black finish, providing additional aesthetic value as well. The fins are electroplated to increase durability, and the heat sink is corrosion-resistant. It is suitable for applications in electronic components as well as industrial applications.

The ATS-13C-128-C1-R0 has an airflow speed of 25 m/s, offering a fast thermal transfer rate which is double compared to traditional heat sinks. It can dissipate temperatures up to 130° and is rated for 200W/m² of power dissipation.

The thermal characteristics of the ATS-13C-128-C1-R0 are excellent. It has a high thermal conductivity and low relative thermal resistance, which allows for effective heat transfer away from the component. Additionally, it features a low pressure drop, meaning that there is less turbulence and air flow resistance over the surface of the heat sink.

The ATS-13C-128-C1-R0 is designed specifically for higher power applications and provides excellent thermal performance at high temperatures. Its small size allows it to fit in tight spaces and its light weight makes it ideal for industrial applications requiring frequent adjustment and mobility.

The ATS-13C-128-C1-R0\'s working principle is based on forced convection, whereby air is forced to flow across the surface of the heat sink, transferring the heat away from the component. The air flow is directed through the channels in the heat sink and is accelerated by the fins, removing heat more quickly than traditional methods. Additionally, the thermal transfer performance is enhanced by the efficient design of the fins and base.

Overall, the ATS-13C-128-C1-R0 is an excellent thermal management solution for high power applications. Its robust construction and efficient thermal design make it an ideal choice for a wide range of applications, from industrial components to consumer electronics.

The specific data is subject to PDF, and the above content is for reference

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