| Allicdata Part #: | ATS22089-ND |
| Manufacturer Part#: |
ATS-13C-131-C2-R0 |
| Price: | $ 5.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13C-131-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.05260 |
| 10 +: | $ 4.91589 |
| 25 +: | $ 4.64285 |
| 50 +: | $ 4.36968 |
| 100 +: | $ 4.09658 |
| 250 +: | $ 3.82347 |
| 500 +: | $ 3.55036 |
| 1000 +: | $ 3.48209 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.60°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are used in many different types of applications, and the ATS-13C-131-C2-R0 heat sink is a popular choice in many industries. This particular heat sink is used to absorb and dissipate heat produced by electronic components, in order to maintain optimum working temperatures. Its design is compact and its components are extremely efficient, making it one of the most popular choices for thermal management.
What is an ATS-13C-131-C2-R0 Heat Sink?
The ATS-13C-131-C2-R0 heat sink is a compact, lightweight aluminum heat sink with a recessed fin design that optimizes the thermal management of electronic components. It has a thermal resistance of only 0.08°C/W, which is significantly lower than many other similar heat sinks. It is designed to provide efficient and reliable cooling, with minimal power draw, and works reliably in both steady-state and pulse switching applications.
Application Fields and Working Principle
The ATS-13C-131-C2-R0 heat sink is mainly used in industrial applications, such as robotics, power supplies, inverters, and lighting. It is also commonly used in high-performance computing and printing applications. It is designed to provide fast and reliable thermal management, and it works by transferring the heat created by electronic components away from them and dissipating it into the environment. This is done by using a combination of convection and radiation principles, with the airflow created by high-speed fans to move the heat away from the components and into the surrounding air.
The heat created by the components is transferred to the aluminum fins of the heat sink, which are specially designed to disperse the heat. The aluminum fins are spaced far enough apart to create an airflow that helps the heat to dissipate more quickly. As a result, the components stay cooler and run even more efficiently. In addition, the aluminum fins are extremely light and provide excellent thermal performance, which makes the ATS-13C-131-C2-R0 heat sink one of the most reliable and efficient options on the market.
Benefits of an ATS-13C-131-C2-R0 Heat Sink
The ATS-13C-131-C2-R0 heat sink is an excellent choice for maintaining the temperature of electronic components. It is extremely efficient, providing reliable and consistent cooling, while using little power. It also has excellent thermal performance and is extremely light, making it an excellent choice for applications where weight and space is a concern. In addition, it features a variety of mounting options, making it easy to install in a wide range of applications.
The ATS-13C-131-C2-R0 heat sink is an excellent choice for any application that requires reliable, efficient cooling, and it is designed to provide superior thermal management and performance. It is an ideal choice for applications that require steady-state and pulse switching applications, providing reliable and consistent cooling with low power draw. It is an excellent choice for any application, offering high performance, excellent thermal management, and minimal power draw.
The specific data is subject to PDF, and the above content is for reference