| Allicdata Part #: | ATS-13C-139-C1-R0-ND |
| Manufacturer Part#: |
ATS-13C-139-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13C-139-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.82933 |
| 30 +: | $ 2.75289 |
| 50 +: | $ 2.60001 |
| 100 +: | $ 2.44705 |
| 250 +: | $ 2.29408 |
| 500 +: | $ 2.21761 |
| 1000 +: | $ 1.98820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are essential components of complex hardware systems. Not only do heat sinks provide a more efficient and reliable cooling system than air cooling or even liquid cooling, they also offer a more cost-effective solution for keeping critical hardware components in optimal temperatures. The ATS-13C-139-C1-R0 is a thermal heat sink manufactured by ATS Systems. This product is designed to provide an efficient cooling solution for processors, GPUs and other high-power components.
The ATS-13C-139-C1-R0 thermal heat sink features a 1.139 mm thin, mixed-flow fin design with a large footprint size to optimize the cooling performance of the heat sink. This high-performance thermal heat sink also utilizes a unique copper construction that is both lightweight and corrosion-resistant, providing excellent all-season protection for your system components. The ATS-13C-139-C1-R0 also features several high-performance heat pipes to increase thermal dissipation capacity and ensure optimal cooling efficiency.
When it comes to application fields, the ATS-13C-139-C1-R0 thermal heat sink can be used for a wide variety of tasks. For instance, it is often used inside high-power gaming PCs to provide enough cooling power for graphics-intensive gaming sessions. This thermal heat sink is also ideal for overclocking GPUs and other components, as it can guarantee sufficient cooling capacity with its cutting-edge performance. Another common usage of the ATS-13C-139-C1-R0 is for heavy-duty servers that require reliable and consistent cooling performance.
The working principle of the ATS-13C-139-C1-R0 thermal heat sink is fairly simple. This device consists of a thin plate that is constructed of copper or any other suitable material. This plate is connected to a series of small pipes with heat pipes or channels, forming a single unit. The heat pipes draw heat from the central processor unit, allowing it to dissipate quickly and evenly through the thin copper plate. The heat-dissipating capacity of this device is then enhanced by its unique fin design which allows for faster circulation of hot air, resulting in a cooler operation.
The ATS-13C-139-C1-R0 is considered one of the most reliable thermal heat sinks available on the market today. With its unique copper construction, wide application field, and superior heat dissipation capacity, this device guarantees maximum cooling efficiency for any system. Moreover, the ATS-13C-139-C1-R0 is a cost-effective purchase for those who are looking for a reliable and efficient cooling system for their high-end system components.
The specific data is subject to PDF, and the above content is for reference