| Allicdata Part #: | ATS22101-ND |
| Manufacturer Part#: |
ATS-13C-142-C2-R0 |
| Price: | $ 3.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13C-142-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.49020 |
| 10 +: | $ 3.40011 |
| 25 +: | $ 3.30800 |
| 50 +: | $ 3.12430 |
| 100 +: | $ 2.94052 |
| 250 +: | $ 2.75675 |
| 500 +: | $ 2.66487 |
| 1000 +: | $ 2.38918 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-13C-142-C2-R0 is a device developed by Avin Technology Solutions. It is categorized as Thermal - Heat Sinks and is used in a wide variety of applications. In this article, we will explore the application fields and working principles of this device, to better understand its features and benefits.
The ATS-13C-142-C2-R0 is a thermal transfer product, designed to dissipate heat from sensitive components. It is made from anodized aluminum, with improved thermal conductivity properties. This device is typically used with electronic components that require a low temperature in order to operate properly. It can be used in both commercial and industrial settings, and is suitable for applications in which heat dissipation is an important factor.
The working principle of the ATS-13C-142-C2-R0 is based on the principle of heat transfer. When the device is attached to a component that is giving off heat, the heat is transferred away from the device and dissipated into the surrounding environment. This is achieved through conduction, which is the transfer of heat from one object to another. The aluminum construction of the device helps to promote heat conduction.
The ATS-13C-142-C2-R0 is designed for a number of different applications. It can be used in computers, to cool CPU and GPU components. It is also suitable for medical equipment and electrical circuitry, to protect sensitive components from over-heating. The device is also suitable for use in automotive and avionics applications, where efficient heat dissipation is a priority.
The ATS-13C-142-C2-R0 is designed with cutting-edge technology, and comes with a wide range of features. It has a high thermal conductivity rating, which ensures that it can efficiently transfer heat away from components. It also comes with a low-profile design, allowing it to fit into tight spaces, and it has a wide temperature range, so it can operate in a variety of environments. Thanks to its sophisticated design, the device is resistant to corrosion, vibration, dust, and water.
In conclusion, the ATS-13C-142-C2-R0 is a versatile thermal transfer product, designed to protect sensitive components from over-heating. With its sophisticated design and high thermal conductivity rating, it is suitable for a wide range of applications, including computer systems, medical equipment, and avionics. The device is also durable and reliable, making it an ideal choice for applications where efficient heat dissipation is a priority.
The specific data is subject to PDF, and the above content is for reference