| Allicdata Part #: | ATS22108-ND |
| Manufacturer Part#: |
ATS-13C-149-C2-R0 |
| Price: | $ 4.10 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X20MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13C-149-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.72330 |
| 10 +: | $ 3.62061 |
| 25 +: | $ 3.41939 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important factor in the design of any machine, system, or electronic component. It is especially critical in electronic systems, where dissipation of heat is of utmost importance. Thermal heat sinks are devices designed to dissipate heat from the components that generate it. ATS-13C-149-C2-R0 is an example of such a heat sink.
ATS-13C-149-C2-R0 is a flat, passive type thermal heat sink. Its dimensions are 149 mm x 60 mm x 19 mm, and it is composed of an aluminum base and multiple copper fins mounted on the base. The aluminum base dissipates heat from the component to the atmosphere, and the copper fins transfer heat further away from the base. The copper fins also improve the surface area for dissipation of heat.
ATS-13C-149-C2-R0 has a thermal resistance of 0.2 K/W. This means that the heat sink can dissipate a watt of heat per 0.2 Kelvin of temperature rise. The performance of this heat sink is further enhanced by the addition of mounting pins. These pins allow the heat sink to be attached to the surface of a printed circuit board (PCB).
The primary application of ATS-13C-149-C2-R0 heat sinks is in cooling electronic components such as power transistors and voltage regulators. The heat sinks can be used in any type of system, including automotive, medical, and industrial, where thermal management is an issue. In fact, it is used in many applications, such as home entertainment systems, computers, and for industrial applications.
In order to function properly, ATS-13C-149-C2-R0 heat sinks rely on the principle of convection. This principle states that heat will naturally move from a hotter area to a cooler area. Heat is dissipated from the component through the base of the heat sink, and then further away from the heat source by the addition of the copper fins. The air in the immediate vicinity of the heat sink is cooled by the fins, and the heat is transferred away from the component and environment.
The ATS-13C-149-C2-R0 is a reliable and efficient thermal management solution. Its optimal design enhances its performance, and its small size makes it ideal for applications where space is at a premium. The aluminum base and copper fins of this heat sink provide it with superior thermal dissipation properties. The presence of mounting pins further improves its performance by allowing for efficient attachment to PCBs.
The specific data is subject to PDF, and the above content is for reference