| Allicdata Part #: | ATS22109-ND |
| Manufacturer Part#: |
ATS-13C-15-C2-R0 |
| Price: | $ 4.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13C-15-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.11390 |
| 10 +: | $ 4.00239 |
| 25 +: | $ 3.77975 |
| 50 +: | $ 3.55748 |
| 100 +: | $ 3.33509 |
| 250 +: | $ 3.11275 |
| 500 +: | $ 2.89041 |
| 1000 +: | $ 2.83483 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential for electronic control systems to ensure reliable performance. Heat sinks such as the ATS-13C-15-C2-R0 are a key component in thermal management. They are used to dissipate heat away from electronic components and away from any external environment. By doing so, they protect sensitive components from being damaged by excessive heat.
An ATS-13C-15-C2-R0 heat sink is typically a rectangular aluminum plate, which is connected to a cooling fan and is designed to fit standard electronic systems. It is typically made of aluminum with a protective anodized coating. An ATS-13C-15-C2-R0 heat sink measures just 15 x 13 centimeters and weighs 1.2 kg. The heat sink has two US-standard water-cooled copper tubes that are connected to the outside of the plate, and one 0.2 millimeter fin spacing allowing for maximum heat transfer.
The ATS-13C-15-C2-R0 heat sink is primarily designed to be used in a wide variety of machine control applications. It is suitable for high power switching applications, as well as motors and actuators. It can also be used for controlling temperature in a range of industrial systems, such as 3D printers, laser systems, robotic systems, CNC machines, and control systems.
The ATS-13C-15-C2-R0 heat sink works by collecting and dissipating heat away from sensitive components. The heat is transferred through thermal conduction, and the heat sink’s fins help to increase the surface area exposed to air, which helps to improve heat dissipation. The copper tubes also help to improve heat transfer by conducting heat away from the device or circuit boards.
Heat sinks are a valuable resource for electronic device designers, as they can help to reduce the amount of heat generated and improve the overall performance of the device. The ATS-13C-15-C2-R0 heat sink is an ideal choice for many applications, as it is designed to fit standard electronic systems and is efficient in dissipating heat away from sensitive components. It is resistant to corrosion and can withstand high temperatures, ensuring long-lasting performance.
The specific data is subject to PDF, and the above content is for reference