| Allicdata Part #: | ATS22117-ND |
| Manufacturer Part#: |
ATS-13C-157-C2-R0 |
| Price: | $ 4.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13C-157-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.10130 |
| 10 +: | $ 3.99042 |
| 25 +: | $ 3.76891 |
| 50 +: | $ 3.54715 |
| 100 +: | $ 3.32545 |
| 250 +: | $ 3.10376 |
| 500 +: | $ 2.88206 |
| 1000 +: | $ 2.82664 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.35°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important factor in maintaining an efficient electronic systemes. Heat sinks are used to dissipate the heat generated by electronic devices, which is essential to the performance of the system. There are numerous types of heat sinks available for electronic systems, and the ATS-13C-157-C2-R0 is one of them.
The ATS-13C-157-C2-R0 is a type of flat-fin heat sink manufactured with aluminum or copper. It has a high profile design that allows for excellent thermal performance. The heat sink is constructed with high quality flat fins allowing for maximum heat dissipation and performance. The fin design also allows for maximum surface area. The heat sink measures 13.5 x 15.7cm and is designed to provide maximum performance when placed onto components prone to high heat.
The ATS-13C-157-C2-R0 is designed specifically for use in a variety of thermal applications. It is designed to dissipate heat from components such as processors, power supplies, and other electronics. The heat sink also offers superior air-flow and helps keep components running at peak performance. It is a highly efficient heat sink, making it an optimal choice for system cooling.
The ATS-13C-157-C2-R0 features an innovative design that allows for excellent performance. It uses a combination of active and passive cooling techniques to maximize heat dissipation. The heat sink features specifically designed fin pattern which helps improve thermal performance even further. The fins are designed to create a strong and steady air-flow through the system. This helps keep the temperature of the components at an optimum level, allowing for optimal performance.
In addition to its thermal performance, the ATS-13C-157-C2-R0 also features adjustable mounting brackets. This allows for easy installation and flexibility. The fins are also equipped with durable construction, making them resistant to damage caused by dust and other elements. The heat sink also works in conjunction with other cooling systems, such as heatsinks and fans, making it a perfect choice for system cooling.
The ATS-13C-157-C2-R0 is an effective and efficient heat sink that is ideal for a variety of thermal applications. Its design and functionality make it an optimal choice for both passive and active cooling solutions. It is also easy to install and offers superior air-flow and cooling. The ATS-13C-157-C2-R0 is an excellent choice for thermal management of electronic systems.
The specific data is subject to PDF, and the above content is for reference