| Allicdata Part #: | ATS22130-ND |
| Manufacturer Part#: |
ATS-13C-169-C2-R0 |
| Price: | $ 3.76 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X10MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13C-169-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.42090 |
| 10 +: | $ 3.32892 |
| 25 +: | $ 3.23870 |
| 50 +: | $ 3.05878 |
| 100 +: | $ 2.87885 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.60896 |
| 1000 +: | $ 2.33906 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.71°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-13C-169-C2-R0 thermal heatsink is an important cooling product for many different types of electronics. It is designed to dissipate heat quickly and efficiently by providing necessary airflow and ventilation. The thermal heatsink is used in a wide range of applications, including consumer electronics, automotive, medical, and industrial. It is also commonly used in computer systems, telecommunication equipment, and other electronics that generate and transfer heat.
The ATS-13C-169-C2-R0 thermal heatsink is constructed using an aluminum extrusion process. This allows for light weight yet durable construction, resulting in a high quality product. The extrusion process helps to reduce air turbulence and vibrations, while increasing heat dissipation.
The ATS-13C-169-C2-R0 thermal heatsink utilizes the forced convection principle. This principle requires the application of a forced air stream to help move air from high to low temperatures, thus transferring heat away from the equipment being cooled. By increasing the intake of air, the heatsink is able to quickly dissipate the heat that is generated from the system.
The ATS-13C-169-C2-R0 thermal heatsink features a unique fin shape that is designed to maximize the air flow and heat dissipation. Instead of the traditional straight fins, this thermal heatsink utilizes specially-designed "winglet" fins. This design helps to increase air velocity and create turbulent air flow, enabling the maximum amount of heat transfer from the equipment.
The ATS-13C-169-C2-R0 thermal heatsink has been designed to be incredibly versatile. It is made to be compatible with a wide range of components, including CPUs, GPUs, and memory. In addition, the heatsink is also able to accommodate a variety of fan sizes. This ensures that the heatsink can be installed in almost any system design, providing the necessary thermal performance required.
The ATS-13C-169-C2-R0 thermal heatsink is an effective cooling solution for many types of electronic systems. It is designed to optimize air velocity and heat dissipation, while still providing a lightweight and durable construction. Through the use of the forced convection principle and its innovative fin design, the heatsink offers maximum cooling efficiency for many different types of components. This makes it an invaluable cooling solution for many different applications.
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