| Allicdata Part #: | ATS-13C-180-C1-R0-ND |
| Manufacturer Part#: |
ATS-13C-180-C1-R0 |
| Price: | $ 3.82 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13C-180-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.47130 |
| 30 +: | $ 3.37743 |
| 50 +: | $ 3.18982 |
| 100 +: | $ 3.00220 |
| 250 +: | $ 2.81459 |
| 500 +: | $ 2.72077 |
| 1000 +: | $ 2.43931 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management technology is used to maximize performance of electronic systems through the efficient dissipation of generated heat from critical circuit components. One such device that is used to manage excessive heat is the ATS-13C-180-C1-R0 heat sink. Through the combination of its construction materials, design, and physical attributes, the ATS-13C-180-C1-R0 has been developed to provide superior cooling performance for a variety of applications.
The ATS-13C-180-C1-R0 is composed of forty-nine aluminum-clad copper fins and a copper base from which the fins protrude. The heatsink utilizes two technologies which create as large of a surface area as possible in order to effectively dissipate the generated heat. On the one hand, the serpentine-shaped configuration of the fins creates increased contact area with the cooling environment. On the other hand, the exposed fins absorb large amounts of generated heat from a circuit component, and they direct the heat along and away from the component. The copper base greatly contributes to the heat sink\'s cooling performance by aiding in the transfer of heat from the components to the fins.
The air-cooled ATS-13C-180-C1-R0 can be used in a variety of applications for the purpose of managing excessive heat. This heat sink can be used to cool CPUs, GPUs, controllers, as well as other components that generate large amounts of heat. In addition, it is often used in personal computers for purposes such as overclocking and gaming. It is also commonly used in communication applications, as well as applications involving electromagnetic disturbances.
The ATS-13C-180-C1-R0 heat sink is extremely efficient at cooling computers and other electronic components. The effectiveness of the heat sink is achieved through its construction materials, design, and physical attributes. These allow the ATS-13C-180-C1-R0 to effectively dissipate heat from critical components, while also providing superior cooling performance for a variety of applications.
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