| Allicdata Part #: | ATS-13C-199-C3-R0-ND |
| Manufacturer Part#: |
ATS-13C-199-C3-R0 |
| Price: | $ 3.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X6MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13C-199-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.41208 |
| 30 +: | $ 3.31968 |
| 50 +: | $ 3.13526 |
| 100 +: | $ 2.95079 |
| 250 +: | $ 2.76641 |
| 500 +: | $ 2.67419 |
| 1000 +: | $ 2.39754 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.95°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-13C-199-C3-R0 thermal heat sink provides efficient cooling for high-performance electronic devices and components. It features a robust construction made from quality aluminum fins and copper heat spreaders, reducing the need for additional thermal management to ensure maximum performance. Through its unique design, the ATS-13C-199-C3-R0 thermal heat sink is able to dissipate heat away from sensitive components quickly and efficiently. It also offers excellent thermal conductivity and a large surface area to ensure effective thermal management.
The application field for the ATS-13C-199-C3-R0 thermal heat sink is diverse and includes such applications as power supplies, telecommunications systems, and high-end computers. Additionally, this thermal heat sink is well-suited for use in LED lighting systems that require rapid cooling. As such, this heat sink can be used in practically any application requiring efficient cooling of a device or component.
The working principle of the ATS-13C-199-C3-R0 thermal heat sink is simple yet highly effective. Heat generated by the device or component is dissipated away from the device or component by the unique design of the aluminum fins and copper heat spreaders. Heat is thus dissipated through convection currents which move the heat away from the device or component. In addition, the large surface area of the thermal heat sink allows for efficient heat transfer.
The ATS-13C-199-C3-R0 thermal heat sink also has a number of features that make it an ideal choice for a variety of applications. One of the most unique features of this heat sink is its ability to reduce power consumption. This is due to the fact that the heat sink is able to dissipate the heat from the device or component more efficiently than other types of heat exchangers, resulting in a reduced power draw. Additionally, the heat sink has a low profile design which helps reduce its weight and improves the overall performance of the device or component.
In conclusion, the ATS-13C-199-C3-R0 thermal heat sink is an excellent choice for ensuring efficient cooling of any device or component in a variety of applications. It is easy to install and offers excellent improved performance with reduced power draw. Additionally, the large surface area of the heat sink ensures effective heat transfer, leading to better cooling performance. As such, the ATS-13C-199-C3-R0 thermal heat sink is an ideal choice for those looking to improve the efficiency of their devices and components.
The specific data is subject to PDF, and the above content is for reference