ATS-13C-23-C2-R0

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Heat sinks are essential components used in electronics setups. By dissipating thermal energy, they can help to regulate temperature, ensure components operate safely, and even prolong the life of the components and the setup. The ATS-13C-23-C2-R0 heat sink is one of the most reliable products available on the market, thanks to its impressive technical characteristics. In this article, we will take a closer look at the ATS-13C-23-C2-R0 and explain its application field and working principle.

Overview of the ATS-13C-23-C2-R0

The ATS-13C-23-C2-R0 is a medium-sized thermal management heat sink manufactured by the American Thermal Systems (ATS) company. It is designed to operate in environments where temperature needs to be regulated and controlled. Thanks to its robust construction, the ATS-13C-23-C2-R0 is capable of withstanding temperatures up to 150°C for almost unlimited periods of time.

The ATS-13C-23-C2-R0 is a standard single-block aluminum extrusion heat sink featuring 52 fins arrayed along the entire side surface of the extrusion and a natural fin height of 40 mm. In addition, it features an internal G 1/4" embedded pipe thread for secure and convenient connection. The overall dimension of the device is 130x210x52 mm and its weight is around 807 g.

Application Field

The ATS-13C-23-C2-R0 heat sink is suitable for a wide range of applications. It is primarily used in high-voltage power supply systems where the temperature needs to be kept low in order to ensure safe and reliable operation of the power supply system. Other common applications include high-performance microcontrollers, processors, graphic cards, and alike. It can also be used in other electronics setups where efficient and reliable heat dissipation is required.

Working Principle

The ATS-13C-23-C2-R0 is a passive cooling device, which means it does not require any external power input for it to work. As such, it relies on forced, or natural, convection in order to dissapate thermal energy. Essentially, this means that air is drawn across the surface of the extrusion, where it absorbs heat that originates from components and transfers it away from the setup. This process is accelerated by the fins, which are specifically designed to increase the heat transfer efficiency.

The use of a suitable thermal compound can further improve the heat transfer performances of the ATS-13C-23-C2-R0 by removing air pockets at the interface between the component and the heat sink. However, it is important to note that a thermal compound is not required for the majority of applications, as the device is capable of efficient heat dissipation without one.

Conclusion

In conclusion, the ATS-13C-23-C2-R0 is a reliable and efficient heat sink suitable for a wide range of applications, from high-voltage power supply systems to high-performance microcontrollers and alike. It relies on the natural convection process to dissapate thermal energy, and the use of a suitable thermal compound can further improve the heat transfer efficiencies. All in all, the ATS-13C-23-C2-R0 is one of the most reliable thermal management heat sinks on the market.

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