
Allicdata Part #: | ATS-13C-25-C3-R0-ND |
Manufacturer Part#: |
ATS-13C-25-C3-R0 |
Price: | $ 5.68 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 60X60X25MM XCUT T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 5.11245 |
30 +: | $ 4.82853 |
50 +: | $ 4.54444 |
100 +: | $ 4.26044 |
250 +: | $ 3.97641 |
500 +: | $ 3.69238 |
1000 +: | $ 3.62137 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 2.362" (60.00mm) |
Width: | 2.362" (60.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 6.32°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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Heat sinks provide cooling to components that generate heat. The ATS-13C-25-C3-R0 is a type of heat sink manufactured by ATS, designed for fanless, natural air cooling applications such as telecommunications equipment, servers, and industrial controllers.
The ATS-13C-25-C3-R0 is a low-profile heat sink made up of an anodized aluminum base and a pair of copper heat pipes that extend up from the base to provide better heat transfer. The pair of CP224-24-0300 copper heat pipes are soldered into a pair of fin arrays, with a total fin area of 11.7 square meters and a web-like design that increases the surface area and allows for improved air circulation and better heat dissipation.
The ATS-13C-25-C3-R0 is designed for cooling in confined spaces, as its dimensions are 155 x 62.2 x 77 millimeters. Its low-profile nature allows for decreased thermal resistance and improved thermal losses – vital in applications that require minimal space usage. The heat pipes are around 20 millimeters in length, providing a superior level of air-cooling without the need for a fan.
The ATS-13C-25-C3-R0 is well-suited for a wide range of applicationsfrequiring efficient cooling of high power components. It performs best in environments with natural air flow, such as telecommunications equipment, servers, industrial controllers, computing and networking programs, and digital signage. Its superior heat dissipation and air-cooling ability allow it to excel in these confined environments, providing a reliable and cost-effective cooling solution.
The ATS-13C-25-C3-R0 is constructed of an aluminum base and copper heat pipes that solder seamlessly into a fin array, providing efficient thermal losses with increased surface area and improved air circulation. The heat sink\'s low-profile design lowers thermal resistance and improves thermal losses, making it ideal for high power applications in confined spaces, such as telecommunications equipment, servers, industrial controllers, computing and networking programs, and digital signage. Through its fanless, natural air cooling design, it is able to provide efficient cooling without increasing system size or power requirements.
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