ATS-13C-25-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-13C-25-C3-R0-ND

Manufacturer Part#:

ATS-13C-25-C3-R0

Price: $ 5.68
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13C-25-C3-R0 datasheetATS-13C-25-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 5.11245
30 +: $ 4.82853
50 +: $ 4.54444
100 +: $ 4.26044
250 +: $ 3.97641
500 +: $ 3.69238
1000 +: $ 3.62137
Stock 1000Can Ship Immediately
$ 5.68
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 6.32°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks provide cooling to components that generate heat. The ATS-13C-25-C3-R0 is a type of heat sink manufactured by ATS, designed for fanless, natural air cooling applications such as telecommunications equipment, servers, and industrial controllers.

The ATS-13C-25-C3-R0 is a low-profile heat sink made up of an anodized aluminum base and a pair of copper heat pipes that extend up from the base to provide better heat transfer. The pair of CP224-24-0300 copper heat pipes are soldered into a pair of fin arrays, with a total fin area of 11.7 square meters and a web-like design that increases the surface area and allows for improved air circulation and better heat dissipation.

The ATS-13C-25-C3-R0 is designed for cooling in confined spaces, as its dimensions are 155 x 62.2 x 77 millimeters. Its low-profile nature allows for decreased thermal resistance and improved thermal losses – vital in applications that require minimal space usage. The heat pipes are around 20 millimeters in length, providing a superior level of air-cooling without the need for a fan.

The ATS-13C-25-C3-R0 is well-suited for a wide range of applicationsfrequiring efficient cooling of high power components. It performs best in environments with natural air flow, such as telecommunications equipment, servers, industrial controllers, computing and networking programs, and digital signage. Its superior heat dissipation and air-cooling ability allow it to excel in these confined environments, providing a reliable and cost-effective cooling solution.

The ATS-13C-25-C3-R0 is constructed of an aluminum base and copper heat pipes that solder seamlessly into a fin array, providing efficient thermal losses with increased surface area and improved air circulation. The heat sink\'s low-profile design lowers thermal resistance and improves thermal losses, making it ideal for high power applications in confined spaces, such as telecommunications equipment, servers, industrial controllers, computing and networking programs, and digital signage. Through its fanless, natural air cooling design, it is able to provide efficient cooling without increasing system size or power requirements.

The specific data is subject to PDF, and the above content is for reference

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