ATS-13C-27-C1-R0

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Thermal management is critical for electronics that generate large amounts of heat, such as components used in electric vehicles, power supplies and heavy machinery. Heat Sinks are designed to absorb and dissipate heat from high power components to keep them from reaching dangerously high temperatures and damaging the electronics. The ATS-13C-27-C1-R0 Heat Sink is a highly efficient thermal heat sink that is designed for high-performance applications.

The ATS-13C-27-C1-R0 Heat Sink is a two-piece aluminum extrusion heat sink with a 27mm fin height and 13mm fin pitch. The fin design is optimized for maximum cooling performance. It is designed to be used with active cooling, such as fans, to ensure the most effective use of its thermal dissipation properties. The heat sink can be mounted directly to the PCB, without the need for additional thermal material, making it an ideal option for integration into high-density electronics and PCBs. The ATS-13C-27-C1-R0 also includes a thermal pad which can be used to define the amount of thermal contact between the heat sink and the device it is attached to.

The ATS-13C-27-C1-R0 Heat Sink is suitable for a wide variety of thermal management applications, particularly those requiring high-power dissipation. The heat sink is commonly used in electric motors, power supplies, control systems, LED lighting, automotive electronics and heavy machinery, among other applications. It can also be used for higher power applications such as servers and lasers.

In terms of its working principle, the ATS-13C-27-C1-R0 is designed to dissipate heat from the device it is attached to. The heat is absorbed by the aluminum fins of the heat sink, which are exposed to the environment to allow for maximum dissipation. The fins are connected by a base plate, which is then attached to the device with thermal material, screws, or clamps. The design of the fins allow for a large surface area on the exterior to allow for maximum heat transfer, while the interior of the fins create a convection current using the air around the heat sink to further enhance thermal transfer. As air passes through the heat sink, heat is transferred from the fins into the environment, thus cooling the device.

The ATS-13C-27-C1-R0 Heat Sink is a highly efficient thermal heat sink designed for high-performance applications. It is suitable for a wide range of applications that require reliable and efficient thermal management solutions. It is easily mounted directly to the PCB, and comes with a thermal pad that can be used to customize the thermal contact between the heat sink and the device it is attached to. The aluminum extrusion design of the heat sink allows for maximum heat absorption and rapid, efficient dissipation, making it an ideal choice for thermal management solutions.

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