ATS-13C-30-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-13C-30-C1-R0-ND

Manufacturer Part#:

ATS-13C-30-C1-R0

Price: $ 7.36
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13C-30-C1-R0 datasheetATS-13C-30-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 6.62760
30 +: $ 6.25947
50 +: $ 5.89138
100 +: $ 5.52315
250 +: $ 5.15494
500 +: $ 4.78673
1000 +: $ 4.69468
Stock 1000Can Ship Immediately
$ 7.36
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal heat sinks are an important component of any electronic design. They are used to dissipate heat away from electronic components to prevent them from overheating. ATS-13C - 30-C1 - R0 is one of the most popular industrial heat sinks available today. This article will provide a detailed overview of the application field and working principle of ATS-13C - 30-C1 - R0.

The ATS-13C - 30-C1 - R0 is designed for use in electronic devices such as automation control, electrical power, data communications, laser and machine vision systems. It is used to help protect these delicate components from the heat generated by the circuitry. The ATS-13C - 30-C1 - R0 heat sink is designed to dissipate heat much faster than standard aluminum heat sinks, making it ideal for higher power applications. This heat sink is also designed to be corrosion-resistant, making it suitable for use in hostile environments.

In terms of its working principle, the ATS-13C - 30-C1 - R0 includes a combination of a finned aluminum heat sink and a high-efficiency aluminum heat exchanger module. The aluminum fins are designed to increase the surface area of the heat exchanger, allowing the heat to be dissipated more quickly and efficiently. Furthermore, the aluminum heat exchanger is designed to be highly thermally conductive, allowing it to dissipate heat more effectively. Combined with the aluminum fins, this makes the ATS-13C - 30-C1 - R0 one of the most efficient heat sinks on the market.

The ATS-13C - 30-C1 - R0 also includes advanced cooling technologies such as adjustable temperature control, active cooling, and over-temperature protection. The adjustable temperature control allows users to customize the temperature of the device, while the active cooling system helps the device maintain optimum cooling performance. Furthermore, the over-temperature protection ensures that the device will shut down in the event of an over-heating situation.

Overall, the ATS-13C - 30-C1 - R0 is an ideal heat sink for many different types of electronic designs. It is designed to dissipate heat quickly and efficiently, while also providing reliable protection against overheating. The advanced cooling technologies allow the device to be used in a variety of different applications. For these reasons, the ATS-13C - 30-C1 - R0 is one of the leading heat sinks on the market today.

The specific data is subject to PDF, and the above content is for reference

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