| Allicdata Part #: | ATS-13C-33-C1-R0-ND |
| Manufacturer Part#: |
ATS-13C-33-C1-R0 |
| Price: | $ 5.41 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X17.78MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13C-33-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.86990 |
| 30 +: | $ 4.59900 |
| 50 +: | $ 4.32860 |
| 100 +: | $ 4.05802 |
| 250 +: | $ 3.78748 |
| 500 +: | $ 3.51695 |
| 1000 +: | $ 3.44932 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 17.40°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-13C-33-C1-R0 Thermal - Heat Sinks
Heat sinks are an essential component of many electronic devices today. They are used to transfer heat away from components by dissipating it into the environment surrounding the component. Proper design and selection of a heat sink are crucial for the successful operation of an electronic device and its components.
The ATS-13C-33-C1-R0 is a thermal-grade aluminium-clad heat sink manufactured by Advanced Thermal Solutions. It is a reliable and efficient thermal solution for a wide range of uses, from military and aerospace electronics to industrial and consumer applications. Its design makes it one of the most advanced solutions on the market.
The ATS-13C-33-C1-R0 consists of a finned aluminium core, which provides an ideal surface area for heat transfer. Its high-performance fin design ensures excellent airflow and thermal stability. Its efficient design reduces system temperatures to maintain optimum performance and reduce system failures. The heat sink is designed to be robust and include features such as robust mounting hardware. Additionally, riveted heat sinks can also increase system efficiency and reduce overall system cost.
The ATS-13C-33-C1-R0 is designed to be extremely efficient in transferring heat away from components. It is designed to maximize airflow and heat transfer, while keeping system components cool. Its efficient design and active cooling methods provide superior performance while minimizing system costs. The ATS-13C-33-C1-R0 includes a dielectric coating and a corrosion-resistant finish to ensure optimal performance and reliable operation.
The ATS-13C-33-C1-R0 can be used in a wide variety of applications, including military and aerospace electronics, consumer electronics, industrial and medical devices. It is also suitable for highly efficient cooling in data centers, servers, storage systems and other high-end electronic components. The heat sink is also compatible with many thermal management systems such as liquid cooling, Peltier cooling and active fan cooling.
The ATS-13C-33-C1-R0 is designed to provide outstanding cooling performance and reliability. Its powerful thermal performance capabilities ensure optimal operation in the most demanding environments. It is an ideal choice for designers and engineers of all types of electronics and thermal management systems.
The specific data is subject to PDF, and the above content is for reference