| Allicdata Part #: | ATS-13C-48-C3-R0-ND |
| Manufacturer Part#: |
ATS-13C-48-C3-R0 |
| Price: | $ 3.82 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13C-48-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.47004 |
| 30 +: | $ 3.27726 |
| 50 +: | $ 3.08448 |
| 100 +: | $ 2.89170 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.50614 |
| 1000 +: | $ 2.45794 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks, thermal compounds, and other cooling solutions have become an essential component for making sure that electronics and computer components runs optimally and avoid overheating. The ATS-13C-48-C3-R0 thermal transfer heat sink is designed for use in systems that need help dissipating the heat generated by the system itself.
This model of ATS heat sink has a 48 mm L-shaped fin array with an aluminum base. It has a total thermal resistance of 0.08°C/W and a power dissipation of 6W. The heat sink has a modern design and artistic look that makes it easy to fit in with modern devices and fits well into the aesthetic of most systems with its silver and black color scheme.
The ATS-13C-48-C3-R0 is designed to be a powerful and effective cooling unit for mid-sized PCBs and ICs and can handle temperatures from -10°C to +80°C with ease. Additionally, the heat sink has a long lifespan and can be used with air or liquid cooling systems.
This model of ATS heat sink uses natural convection to help keep your system cool. This occurs when the air coming into contact with the heat sink’s fins is hotter than the fins themselves. This causes the hotter air to rise, pulling cooler air from the bottom of the heat sink and pushing the hot air away. In order to get the most out of this thermal transfer, it is important to make sure that the incoming airflow is unobstructed and that the heat sink is installed properly.
This same principle is used with more active cooling solutions, such as fan-based coolers. By having a fan to “force” the warm air away from the heat sink, the ATS-13C-48-C3-R0 is able to dissipate more heat with greater efficiency than with natural convection alone.
The ATS-13C-48-C3-R0 thermal heat sink is an effective solution for mid-sized PCBs and ICs that are producing more heat than they can dissipate on their own. Its design makes it easy to fit in with a myriad of building systems, and its use of natural convection or active cooling solutions makes it an efficient and reliable cooling choice.
The specific data is subject to PDF, and the above content is for reference