ATS-13C-50-C1-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

ATS-13C-50-C1-R0 Thermal - Heat Sinks Application Field and Working Principle

A thermal - heat sink is a device that is used for the purpose of dissipating heat from an object to its surroundings. The primary application is in the electronics field, where it is used to cool components that generate high levels of heat as the result of current flow. Heat sinks are also used to protect components from extreme temperatures, as well as to affect changes to the overall temperature of a system.

ATS-13C-50-C1-R0 is a a thermal - heat sink designed for higher power, larger heat load applications such as computer servers and storage subsystems. It utilizes an active cooling technology to help reduce thermal resistance within the heat sink and to optimize airflow. The innovative design has been proven to improve the thermal performance over traditional cooling methods by up to 50%.

The ATS-13C-50-C1-R0 uses a combination of features, including an extruded aluminum fin stack, to maximize loss of heat from the source to the environment. This heat sink\'s extrusion design also features a unique shape that maximizes the fin surface area, allowing for more efficient cooling. Additionally, the fins are oriented at an inclined angle to maximize the surface area and enhance the ability to transfer heat away from the component. The ATS-13C-50-C1-R0 also includes a cast aluminum base plate that provides a secure and stable foundation for the heat sink.

The ATS-13C-50-C1-R0 is designed for use in applications where thermal control is critical. This is particularly important in applications where high CPU utilization is required. The thermal resistance is minimized, thus enabling higher power levels than with traditional heat sinks. Additionally, the device helps reduce fan noise, since optimal airflow through the heat sink increases cooling efficiency and reduces swirling around the device.

The working principle of the ATS-13C-50-C1-R0 thermal - heat sink is based on the principles of thermodynamics. It utilizes conduction, convection, and radiation to draw the heat away from the source and disperse it into the environment. In conduction, heat is transferred from the component being cooled to the fins of the heat sink via contact. The heat is then convected away from the fins by the airflow. Finally, the heat is radiated away from the fins, into the surrounding environment by radiation.

In addition to providing thermal performance, the ATS-13C-50-C1-R0 also offers several other features that make it an attractive option in many applications. For instance, the extruded aluminum design offers high durability, as well as a wide selection of mounting options. Furthermore, the device is lightweight and easy to install, making it an ideal choice for applications where size and weight are critical. Finally, the device is RoHS compliant, ensuring maximum safety when used in areas with hazardous material.

The ATS-13C-50-C1-R0 thermal - heat sink is an ideal choice for applications where thermal performance and reliability are critical. Its unique features and design make it capable of dissipating heat efficiently and helping reduce fan noise. Additionally, the device is lightweight and easy to install, making it an attractive option for many users. Finally, its RoHS certification ensures that the device is safe to use in hazardous material areas.

The specific data is subject to PDF, and the above content is for reference