| Allicdata Part #: | ATS-13C-51-C1-R0-ND |
| Manufacturer Part#: |
ATS-13C-51-C1-R0 |
| Price: | $ 3.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13C-51-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.03156 |
| 30 +: | $ 2.94945 |
| 50 +: | $ 2.78573 |
| 100 +: | $ 2.62181 |
| 250 +: | $ 2.45796 |
| 500 +: | $ 2.37602 |
| 1000 +: | $ 2.13022 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices utilized to transfer waste heat away from vital components. Waste heat can be created from a variety of devices, but is most common with electronic components. Such components could be transistors, resistors, amplifiers, and even CPUs. It is essential that these components don’t reach excessive temperatures, as this can damage the components and surrounding items. If a heat-generating element is squeezed into a tiny device, for example, a circuit board, the heat generated could cause damage to the circuit board. To prevent this, a device like the ATS-13C-51-C1-R0 Heat Sink is employed to transfer heat away from the device.
The ATS-13C-51-C1-R0 Heat Sink is a highly reliable, low-cost heat transfer solution. It can be used in applications ranging from consumer electronics to industrial equipment. Its most common application is to move heat away from electronic components on a PCB. It has a low profile and is simple to install. Unlike many other heat sinks, it is equipped with a clip that securely and easily attaches to any component. This makes installation a breeze, and allows for it to be attached to components of varying sizes and shapes.
The ATS-13C-51-C1-R0 heat sink is composed of a copper core which is then coated with a black anodized finish. This finish provides excellent corrosion resistance and helps to retain the integrity of the copper core over time. The base, fins and outer casing are also made from aluminum, allowing for maximum heat dissipation. Additionally, the fins are designed in such a way as to make them more effective at cooling components than traditional heatsinks. This is accomplished by utilizing an offset pattern that allows air to move throughout the entire heatsink.
The working principle of the ATS-13C-51-C1-R0 Heat Sink is fairly straightforward. First, the copper core absorbs heat produced by the device that it is attached to. This heat is then dissipated into the air around the heatsink via the aluminum fins. As air moves around the fins, the heat is further dissipated and the heatsink cools down. This process continues until the heat generated by the device has been adequately transferred away from it.
The ATS-13C-51-C1-R0 Heat Sink is a great option for applications that require effective and reliable heat transfer. Its low profile makes it easy to install and its offset fin design optimizes air flow, allowing it to be more effective than many other heatsinks. Additionally, its aluminum and copper construction ensures that it can withstand corrosion and retain its reliable cooling abilities for many years. As a result, the ATS-13C-51-C1-R0 Heat Sink is an excellent choice for any application that requires effective heat transfer away from delicate components.
The specific data is subject to PDF, and the above content is for reference