| Allicdata Part #: | ATS-13C-55-C3-R0-ND |
| Manufacturer Part#: |
ATS-13C-55-C3-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13C-55-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.31695 |
| 30 +: | $ 3.22707 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 24.11°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
ATS-13C-55-C3-R0 is a type of thermal-heat sink, which is primarily used to dissipate the heat generated from electronic devices to keep them from overheating. The heat sink is composed of a metal plate with an outer cooling fin attached to it. The metal plate has holes in it, designed to allow air to flow through and around the thermal-heat sink. This airflow causes the temperature of the air, and therefore the temperature of the object, to decrease. The metal plate is also designed to absorb some of the heat from the object and transfer it to the ambient environment.
The unique design of ATS-13C-55-C3-R0 allows it to have a much higher thermal conductivity than many other thermal-heat sinks. This makes it especially useful for applications where high levels of heat transfer are necessary. It is often used to cool components such as microprocessors, video cards, and gaming consoles. The metal plate of the ATS-13C-55-C3-R0 also has a wide range of fin sizes, allowing it to dissipate heat faster or slower depending on the application.
In addition to cooling, the ATS-13C-55-C3-R0 also offers a range of other features. For instance, the metal plate of the thermal-heat sink can be mounted onto cases to provide additional mounting locations for components. The metal plate is also designed to allow components to be easily clipped in, allowing for quick and easy installation. The cooling fin is also designed to provide extra protection against dust, debris, and other contaminants that may enter the case of the device.
To use the ATS-13C-55-C3-R0, it first needs to be mounted onto the appropriate electrical device, such as a motherboard. Once mounted, the cooling fins on the metal plate need to be adjusted to allow air to travel freely and around the thermal-heat sink. After this, the power of the device can be connected and the thermal-heat sink will begin to dissipate the heat generated from the device.
The ATS-13C-55-C3-R0 is a highly efficient thermal-heat sink that can be used in a variety of applications. Its unique design lends itself well to cooling applications and its ability to dissipate heat quickly can mean the difference between having a device that works or one that fails. With its wide range of fin sizes and other features, the ATS-13C-55-C3-R0 can be the perfect addition to any system.
The specific data is subject to PDF, and the above content is for reference