| Allicdata Part #: | ATS-13C-65-C3-R0-ND |
| Manufacturer Part#: |
ATS-13C-65-C3-R0 |
| Price: | $ 4.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13C-65-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.15233 |
| 30 +: | $ 3.92175 |
| 50 +: | $ 3.69104 |
| 100 +: | $ 3.46040 |
| 250 +: | $ 3.22971 |
| 500 +: | $ 2.99902 |
| 1000 +: | $ 2.94134 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.40°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are an essential component in many electronic systems. ATS-13C-65-C3-R0 is a thermally-controlled enclosure designed to help dissipate heat away from sensitive electronics. By keeping the heat away from delicate components, the device is able to maintain optimal temperatures and ensure efficient functioning of the system.
The ATS-13C-65-C3-R0 features two key components - the enclosure and the fan. The enclosure is constructed of aluminum which is an excellent thermal conductor. This helps transfer heat away from the protected components, as well as providing robust protection from physical damage. The enclosure also features an internal heat spreader, which ensures uniform thermal distribution throughout.
The fan is used to actively remove heat from the enclosure. The fan is designed to be effective at extracting heat, even in small spaces. The fan is powered by an external power source, and features a temperature-sensitive control which turns the fan on and off depending on the temperature inside the enclosure.
Once the system is powered up, the fan begins the task of removing excessive heat from the enclosure. The fan is designed to maximize the transfer of heat away from sensitive components, while ensuring minimal noise levels. The fan is also designed to be power efficient, allowing it to run at low speeds without sacrificing performance.
The ATS-13C-65-C3-R0 is most commonly used in telecommunications and data centers to keep sensitive components, such as processors and memories, cool. It is also commonly used in medical equipment and industrial applications, where temperature regulation is vital for safe and accurate operation.
In summary, the ATS-13C-65-C3-R0 is a thermally-controlled enclosure designed to keep sensitive components cool. It features an aluminum enclosure and internal heat spreader, as well as a temperature-sensitive fan for actively siphoning heat away from the enclosure. The device is power efficient, with minimal noise levels, and is an excellent choice for telecommunications, data centers, medical equipment, and other industrial applications.
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