ATS-13C-70-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.70°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction
The ATS-13C-70-C2-R0 is a thermal heat sink. It is designed to dissipate heat away from a component or device to more effectively transfer the energy out of the system. It works by drawing heat away from the components and dissipating it to the surrounding air. In essence, the heat sink acts as an additional thermal conduction path that provides an alternate path for the heat generated in a device or component to flow away.

Design and Construction
The ATS-13C-70-C2-R0 thermal heat sink is constructed from aluminum with an anodized finish. This provides corrosion resistance and good thermal conductivity. It is composed of two pieces: a base and a top. The base is a flat plate designed to fit to the component or device that needs to be cooled. The top is a series of metal fins that spreads the heat over a wider surface area. It also includes a thermally conductive adhesive pad that ensures that the heat is evenly distributed and efficiently transferred out of the component or device. The top consists of a series of blades which increases surface area and allows for maximum dissipation of the heat away from the device.

Operation Principles
The ATS-13C-70-C2-R0 heat sink operates on the principle of passive thermal conduction. A thermal conductor, such as aluminum, is efficient in dissipating heat or thermal energy. The aluminum material of the heat sink will conduct the thermal energy from the component or device to the surface of the heat sink which increases in surface area by the series of fins and blades. This then in turn cools the component or device quickly and efficiently. The adhesive pad ensures that this process is possible by reducing the thermal resistance which in turn helps the heat sink to be very effective in heat transfer.

Application Areas
The ATS-13C-70-C2-R0 heat sink is designed to be used in a variety of applications. It can be used to cool down components in a computer system, such as CPUs, GPUs, and motherboards. It can also be used in industrial and commercial systems such as medical devices, industrial components, and automotive parts. It can also be used to cool down electronic components in telecommunications equipment, home theater systems, and other audio visual systems. By dissipating the excess heat away from the components, the ATS-13C-70-C2-R0 heat sink helps to preserve the functionality and the lifespan of the component or device.

Advantages
The ATS-13C-70-C2-R0 thermal heat sink offers several advantages over other cooling solutions. The aluminum material is lightweight, durable, and cost effective. It also provides good thermal conductivity and good corrosion resistance. Additionally, the design of the heat sink increases the surface area which in turn increases the rate of heat dissipation. Furthermore, the adhesive pad included with the heat sink provides a good thermal connection between the component or device to be cooled and the heat sink. This helps to reduce thermal resistance, reducing the need to replace the heat sink frequently.

Conclusion
Overall, the ATS-13C-70-C2-R0 thermal heat sink is an effective and efficient cooling solution. It is designed to spread the thermal energy over a large surface area, helping to reduce the heat generated in a system. The aluminum material provides good thermal conductivity and corrosion resistance. Additionally, the adhesive pad ensures that the heat is effectively transferred away from the component or device. The ATS-13C-70-C2-R0 heat sink is designed to help preserve the functionality and longevity of a component or device in a variety of applications.

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