| Allicdata Part #: | ATS-13C-83-C3-R0-ND |
| Manufacturer Part#: |
ATS-13C-83-C3-R0 |
| Price: | $ 4.00 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13C-83-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.63195 |
| 30 +: | $ 3.43014 |
| 50 +: | $ 3.22837 |
| 100 +: | $ 3.02665 |
| 250 +: | $ 2.82487 |
| 500 +: | $ 2.62310 |
| 1000 +: | $ 2.57265 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.76°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal Management Solutions, such as heat sinks, are key components in the functioning of electronic systems. Heat sinks are used to dissipate the heat generated by integrated circuits, processors, and other high power components and prevent them from overheating. The ATS-13C-83-C3-R0 has become the industry standard for heat sink thermal management applications.
The ATS-13C-83-C3-R0 is a highly versatile thermal management solution designed to meet the needs of a wide range of applications. The ATS-13C-83-C3-R0 consists of a copper housing that is formed from a single piece of extruded material. The housing has a large number of internal fins that provide a high surface area to dissipate the heat. The fins also provide the added benefit of increasing the thermal efficiency of the ATS-13C-83-C3-R0 by providing an additional cooling surface.
The ATS-13C-83-C3-R0 is designed to dissipate heat quickly and efficiently. The design utilizes specially designed fins that allow for increased air flow. The built-in fins are designed to deflect heat away from the housing and to promote the heat exchange process. Furthermore, the ATS-13C-83-C3-R0 utilizes an internal heat conductor that can accommodate a variety of heat-producing components. The internal conductor is also designed to provide a conductive pathway to the fins for maximum efficiency.
The ATS-13C-83-C3-R0 is designed for applications ranging from simple computing tasks to the most demanding industrial and aerospace applications. The heat sink is designed to work with a wide range of integrated circuits and processors, including ones which generate high power. The ATS-13C-83-C3-R0 is also relatively lightweight when compared to other thermal management solutions, making it an ideal choice for applications where weight is a concern.
The ATS-13C-83-C3-R0 is designed to last for a long period of time, and is resistant to degradation and dirt particles. The device is also designed to be easy to install and maintain. The device can be quickly and easily installed on various surfaces and is easy to service when necessary.
In addition to providing an efficient cooling solution for electronic components, the ATS-13C-83-C3-R0 also provides an economical solution. The device has a relatively low purchase price, and the associated cooling costs are also lower than other thermal management solutions. This allows for budget friendly alternatives for thermal management applications.
The ATS-13C-83-C3-R0 is an ideal thermal management solution for a variety of applications. The device is particularly suited for applications such as high power computing, industrial applications, aerospace applications, and more. With its robust design and reliable performance, the ATS-13C-83-C3-R0 is an excellent choice for any thermal management application.
The specific data is subject to PDF, and the above content is for reference