| Allicdata Part #: | ATS-13D-06-C1-R0-ND |
| Manufacturer Part#: |
ATS-13D-06-C1-R0 |
| Price: | $ 3.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13D-06-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.92446 |
| 30 +: | $ 2.84550 |
| 50 +: | $ 2.68733 |
| 100 +: | $ 2.52926 |
| 250 +: | $ 2.37119 |
| 500 +: | $ 2.29216 |
| 1000 +: | $ 2.05503 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.15°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat sink technology has been around for a long time and is essential for thermal management in many industrial or commercial applications. The ATS-13D-06-C1-R0 is a type of heat sink, designed for use in high-power consumer electronics, specifically in power supplies and other areas where reliable thermal performance and cooling are required. This article will discuss the application field and working principle of the ATS-13D-06-C1-R0.
The ATS-13D-06-C1-R0 is designed for use in power supplies up to 50W, providing effective thermal management in demanding environments. It offers a combination of quick heat rejection, excellent thermal performance, and a wide range of mounting options. It is designed to be easy to install and can be used in a wide variety of applications, delivering reliable cooling performance and ensuring longer component life.
The main feature of the ATS-13D-06-C1-R0 is its highly efficient heat rejection. It is designed to dissipate heat quickly and evenly, allowing for a greater range of component cooling and thermal transfer. The heat sink utilizes high-performance aluminum fins to maximize thermal transfer across the entire surface area. It is also designed to provide noise-free operation, so it is suitable for use in home theaters and other noise-sensitive applications.
In general, the heat sink consists of an aluminum baseplate, fins, and a fan. The fins are arranged in a variety of different patterns and designs, depending on the configuration and desired cooling performance. The fan is mounted on top of the fin array and provides the necessary air circulation across the surface of the heat sink. The air flows across the fins, transferring heat away from the components and dissipating it into the air.
For optimal thermal performance, the ATS-13D-06-C1-R0 should be installed so that the fins are parallel to the direction of airflow. This allows for full utilization of the air circulation and allows the heat sink to operate more efficiently. Additionally, the fins should be well spaced apart to provide a consistent flow of air and maximize heat transfer.
The ATS-13D-06-C1-R0 is also designed for use in a variety of mounting options. It is compatible with most standard mounting brackets and can be mounted on the chassis of the device or to a wall or ceiling. This allows the heat sink to be installed in a variety of configurations depending on the environment and the cooling needs of the application.
The ATS-13D-06-C1-R0 is an ideal solution for high-power consumer electronics, providing reliable cooling performance and easy installation. This heat sink utilizes advanced thermal transfer technology and provides easy mounting and effective noise-free operation, making it suitable for use in a variety of applications.
The specific data is subject to PDF, and the above content is for reference