ATS-13D-117-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.46°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to the ATS-13D-117-C1-R0

The ATS-13D-117-C1-R0 is a versatile thermal heat sink that is designed to provide optimum cooling to a range of components and systems. The thermal film-based design uses an aluminum-alloy thermal interface to transfer heat away from the components to the surroundings.

Application Field and Working Principle of the ATS-13D-117-C1-R0

The ATS-13D-117-C1-R0 thermal heat sink is suitable for a wide range of applications, including automotive, medical, and industrial electronics. Its thin profile is ideal for applications such as astronauts in small-space, where maximum cooling is required with minimal surface area. It can be employed for applications including the cooling of mobile devices, GPUs, CPUs, power supplies, and other electronics with compact form factors.The thermal film-based design of the ATS-13D-117-C1-R0 creates a high thermal conductivity path between the component and the surrounding environment. This facilitates the removal of heat from the component surface and lowering of the component temperature. The thermal film is composed of a layer of aluminum-alloy which, when compressed, functions as an effective thermal interface material and provides improved heat dissipation over traditional heat sinks.The thermal film of the ATS-13D-117-C1-R0 is secured to the component by adhesive backing. Once the thermal film is in place, any remaining air gaps between the component surface and the thermal film are filled with a thermally conductive compound. This helps to ensure maximum thermal contact between the component surface and the heat sink.The thermal film also functions as an air dam, which serves to create an air gap between the component and the heat sink. This air gap helps to prevent hot air from recirculating back onto the component and thus, increasing temperatures. The air dam also reduces the overall temperature of the heat sink, which aids in the dissipation of heat away from the component.

Conclusion

The ATS-13D-117-C1-R0 is a versatile, thermal film-based, aluminum-alloy heat sink that is suitable for a variety of applications. Its thin profile and improved heat dissipation make it ideal for components located in small-space. By using the thermal film as an air dam to reduce air recirculation, the ATS-13D-117-C1-R0 is able to provide effective cooling with minimal surface area.

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