| Allicdata Part #: | ATS-13D-124-C1-R0-ND |
| Manufacturer Part#: |
ATS-13D-124-C1-R0 |
| Price: | $ 3.49 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13D-124-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.17394 |
| 30 +: | $ 3.08826 |
| 50 +: | $ 2.91677 |
| 100 +: | $ 2.74516 |
| 250 +: | $ 2.57363 |
| 500 +: | $ 2.48783 |
| 1000 +: | $ 2.23047 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.16°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential for the proper functioning and safe operation of most electrical devices. The ATS-13D-124-C1-R0 is a passive thermal management device designed to effectively transfer heat away from sensitive components, thereby increasing system reliability. This heat sink is well-suited for applications in a wide range of industries, including medical, aerospace, industrial, and consumer electronics.
The ATS-13D-124-C1-R0 is a compact, low-profile heat sink. The device features a wide range of heat dissipation capabilities, with a thermal resistance of 0.29 °C/W with an air gap of 4 mm. The device is equipped with a variety of features that make it ideal for a broad range of thermal management applications. It features an integral mounting flange, allowing for easy installation and removal. The device is lightweight but durable, and its construction is designed to withstand extreme temperatures. The fins are specially designed to maximize heat dissipation, while the base is copper for optimal thermal conductivity. The heat sink is designed to be corrosion resistant, ensuring a longer service life.
The ATS-13D-124-C1-R0 works by dispersing heat away from its source. Heat is dissipated as the heat sink absorbs heat from the component or system it is attached to, and disperses it into the surrounding environment. The fins help to increase the surface area of the heat sink, which allows for more effective heat dissipation. Additionally, the fins are specially curved to create an air foil structure that helps to reduce the amount of air resistance and improve the device\'s heat transfer efficiency. The copper base is well-suited for applications with higher temperatures, as it conducts heat more efficiently than other materials.
The ATS-13D-124-C1-R0 is a robust and reliable device, capable of handling a range of thermal management applications. It is suitable for applications where space is limited, as it is relatively compact and lightweight. The device is also highly effective at dissipating heat. In addition, its corrosion-resistant construction ensures a longer service life. This makes the ATS-13D-124-C1-R0 a great choice for a wide range of thermal management applications.
The specific data is subject to PDF, and the above content is for reference