| Allicdata Part #: | ATS-13D-137-C3-R0-ND |
| Manufacturer Part#: |
ATS-13D-137-C3-R0 |
| Price: | $ 3.20 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13D-137-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.91249 |
| 30 +: | $ 2.83395 |
| 50 +: | $ 2.67649 |
| 100 +: | $ 2.51899 |
| 250 +: | $ 2.36157 |
| 500 +: | $ 2.28284 |
| 1000 +: | $ 2.04668 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.63°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are devices that absorb and dissipate the heat generated by electronics components, such as processors, during normal operation. It is an essential part of any system design to keep these components within their maximum temperature. ATS-13D-137-C3-R0 is a thermal-heat sink which can be used to dissipate the heat inside the component and increase the total heat dissipation area of the device.
ATS-13D-137-C3-R0 is a highly advanced solution in cooling components of integrated circuits and systems. This thermal-heat sink consists of a high-quality aluminum housing with an anodized finish and copper heat pipes. The copper pipes are 8mm in diameter and are coated with a nickel plating to increase electrical and thermal conductivity. The housing also features grooves to take in air flow more efficiently and provide better cooling.
This device also features a fan to ensure that airflow is properly managed and the heat sink is performing at an optimal level. The fan is capable of spinning up to 3000 RPM and has a noise level of less than 20dB, making it suitable for any application that does not require a high level of noise reduction. Additionally, this device features a variable speed driver which allows it to be tuned to the speed that best fits the application.
The working principle of the ATS-13D-137-C3-R0 is fairly simple. When an electronic device is in use, its temperature rises beyond the optimal level. This heat is then dissipated into the nearby environment through the heat sink. The heat sink is designed with certain materials and features that enable it to absorb and conduct the heat away from the component. The copper pipes inside the heat sink direct the heat away from the component and out of the device.
The fan helps in convecting the heat away from the device and the grooves also assist in this process as they allow air to be taken in from any direction and help in cooling off the device. This heat sink is suitable for a variety of applications, ranging from consumer electronics, industrial control systems, automotive applications, and more.
In conclusion, the ATS-13D-137-C3-R0 thermal-heat sink is a high-performance device that can help to keep your devices working efficiently and within their temperature parameter. The copper pipes, fan, and grooves ensure that the device is able to keep its cool and dissipate the heat generated during normal operation. This device is a good solution for applications that require it to stay stable, reliable, and operate within a specified temperature range.
The specific data is subject to PDF, and the above content is for reference