| Allicdata Part #: | ATS-13D-139-C1-R0-ND |
| Manufacturer Part#: |
ATS-13D-139-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13D-139-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.82933 |
| 30 +: | $ 2.75289 |
| 50 +: | $ 2.60001 |
| 100 +: | $ 2.44705 |
| 250 +: | $ 2.29408 |
| 500 +: | $ 2.21761 |
| 1000 +: | $ 1.98820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-13D-139-C1-R0 plays an important role in the thermal management of electronic equipment. The advanced thermal heatsink technology used in this component is ideal for achieving balanced cooling performance when cooling power dense components or parts of large electronic systems. This applicator has good performance in heat dissipation, high temperature conditioning, temperature control and other related applications.
As the name implies, the ATS-13D-139-C1-R0 is a heat sink applicator which utilizes thermal convection to dissipate heat generated by components in an efficient manner. The component is composed of two main parts - the heatsink base and the heatsink set which allow convective cooling to occur. Heat is transferred from the electronic component through the base to the external heatsink set and is further dissipated into the environment.
The heat sink design of the ATS-13D-139-C1-R0 enables the component to be very effective in dissipating large amounts of heat. In addition, the design also helps reduce the overall temperature of the system, ensuring optimal thermal performance. The deep fin design on the heatsink allows excellent air circulation within the component. The material used in the base and heatsink set is also designed to be lightweight and durable.
The ATS-13D-139-C1-R0 has a wide range of applications. It can be used for hot spots in control panels, power supplies and other electronics, for measuring and conducting heat transfer. The component can also be used to cool high performance processors, memory and other electronic components. Moreover, it can also be used in temperature control systems, such as solar heating systems and refrigeration systems.
In addition to its cooling applications, the ATS-13D-139-C1-R0 also has a wide range of other uses. For instance, it can be used in devices such as printers, laser cutting machines and the like. The component is also suitable for applications such as the production of small electronic parts and components.
The working principle behind the ATS-13D-139-C1-R0 is relatively simple; the heatsink base and heatsink set work together to dissipate heat generated by the components to the environment. The base and set are manufactured using an advanced aluminum alloy which allows the heat to be dissipated quickly. As the temperature of the component rises, heat is conducted and convected through the base and set, resulting in a decrease in temperature of the component.
The ATS-13D-139-C1-R0 is an excellent heat sink applicator, capable of dissipating large amounts of heat in a variety of electronic components and devices. Thanks to its light weight and compact design, it can be used in a range of thermal management applications, offering balanced cooling performance.
The specific data is subject to PDF, and the above content is for reference