| Allicdata Part #: | ATS-13D-140-C1-R0-ND |
| Manufacturer Part#: |
ATS-13D-140-C1-R0 |
| Price: | $ 3.17 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13D-140-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.87721 |
| 30 +: | $ 2.79909 |
| 50 +: | $ 2.64361 |
| 100 +: | $ 2.48812 |
| 250 +: | $ 2.33264 |
| 500 +: | $ 2.25488 |
| 1000 +: | $ 2.02162 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are components used to improve the cooling of electronic components or devices by helping to dissipate heat away from them. One of the most common heat sinks used today is the ATS-13D-140-C1-R0, designed for use with a wide range of temperatures and environments. The ATS-13D-140-C1-R0 is a thermal thermal heat sink that provides efficient heat dissipation from embedded devices. Its dissipating area is 140 cm2 and it has an R-value of 0.9.
This heat sink has a unique design that allows it to dissipate heat quickly and efficiently. It is made of aluminum that has been machined to create a finned shape which increases the surface area of the heat sink, allowing for greater cooling efficiency. The aluminum is also given an anodized finish that helps to resist corrosion and dirt, as well as provide a long-lasting finish that won\'t degrade over time. A fin design is also used to create the best airflow around the heat sink, helping to draw the heat away from the device more efficiently.
The ATS-13D-140-C1-R0 is most commonly used in applications where cooling is required to keep temperatures in check, such as in laptops, desktop computers, industrial equipment, or high-performance electronics. It is able to withstand high temperatures ranging from -40°C to +85°C, and has a maximum ambient temperature of +85°C as well. This heat sink is also relatively lightweight, making it easy to install, and its size makes it suitable for a wide variety of applications.
The ATS-13D-140-C1-R0 offers an efficient heat transfer solution to help keep electronic components cool, and is ideal for use in industrial and commercial applications that require reliable cooling. Its design allows for increased surface area, greater cooling efficiency, and improved air circulation for better heat dissipation. This heat sink is an excellent choice for thermal management applications where a reliable and efficient cooling solution is needed.
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