| Allicdata Part #: | ATS-13D-148-C1-R0-ND |
| Manufacturer Part#: |
ATS-13D-148-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X15MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13D-148-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.56°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are used to dissipate heat generated by electronic components to ensure that the components remain within their safe temperature range. ATS-13D-148-C1-R0 is a type of thermal heat sink, and its application field and working principle should be described in detail.
The ATS-13D-148-C1-R0 thermal heat sink is typically used in applications involving high-power transistors or diodes, such as switching regulators, motor drives and DC-DC converters. It is designed to keep components running within their safe temperature range under heavy workloads. The ATS-13D-148-C1-R0 is a combination of a stamped heat sink, a metalized ceramic substrate and a thermally conductive adhesive tape.
The stamped heat sink is composed of a fin heat sink profile that allows for increased heat dissipation. The stamped fins increase the surface area of the heat sink, allowing for greater heat dissipation. The metalized ceramic substrate enhances heat transfer from the component to the fin heat sink, improving the overall thermal performance of the ATS-13D-148-C1-R0.
The thermally conductive adhesive tape ensures a good contact between the component and heat sink, eliminating air gaps that reduce the thermal performance of the heat sink. The tape also serves to securely fasten the component and the heat sink together. Additionally, the tape is resistant to vibration, further ensuring a secure connection between the component and the heat sink.
The working principle of the ATS-13D-148-C1-R0 thermal heat sink is quite simple. The component generates heat, which is then dissipated by the heat sink’s fins and ceramic substrate. The thermally conductive adhesive tape ensures that the component and heat sink are securely connected, and the tape’s vibration resistance ensures that the connection is maintained over time.
In summary, the ATS-13D-148-C1-R0 thermal heat sink is designed for applications involving high-power transistors or diodes, such as switching regulators, motor drives and DC-DC converters. The stamped fins and ceramic substrate ensure adequate thermal performance, while the thermally conductive adhesive tape ensures a secure connection between the component and heat sink. The working principle of the ATS-13D-148-C1-R0 is simple, and it ensures that components remain within their safe temperature range while running at high power.
The specific data is subject to PDF, and the above content is for reference