| Allicdata Part #: | ATS-13D-167-C1-R0-ND |
| Manufacturer Part#: |
ATS-13D-167-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13D-167-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.82933 |
| 30 +: | $ 2.75289 |
| 50 +: | $ 2.60001 |
| 100 +: | $ 2.44705 |
| 250 +: | $ 2.29408 |
| 500 +: | $ 2.21761 |
| 1000 +: | $ 1.98820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important aspect of any electrical device or system. Heat sinks are used to dissipate heat from components and help maintain a safe operating temperature. ATS-13D-167-C1-R0 is a passive thermal device that has applications in various industries, including aerospace, automotive, consumer electronics, and industrial components. This article discusses the application field and working principle of ATS-13D-167-C1-R0.
ATS-13D-167-C1-R0 is a type of extruded aluminum heat sink that comes with an integrated fan. Its application fields include processors, DC-DC converters, and telecommunications systems. Due to its low profile and low noise emission, it is ideal for applications in which space and noise levels are critical. The heat sink is also designed to dissipate heat quickly and efficiently. In addition, its fin geometry and cross-cut pattern optimize its thermal performance, thus making it suitable for high-power devices with high heat densities.
The working principle of ATS-13D-167-C1-R0 is based on the process of conduction and convection. Conduction occurs when heat is transferred from one component to another through direct contact. As heat is absorbed by the heat sink, it is slowly transferred away from the device, resulting in a cooling effect. On the other hand, convection is the process in which heat is transferred from the device to the environment through air movement. In the case of ATS-13D-167-C1-R0, the fan helps to accelerate the process of convection, thereby achieving better thermal performance.
Besides conduction and convection, the ATS-13D-167-C1-R0 also utilizes radiative cooling. This is a process in which a radiation source emits electromagnetic waves, including infrared radiation, in order to help dissipate heat from the device. The ATS-13D-167-C1-R0 has a highly reflective surface that helps to absorb and scatter energy, thus allowing it to more effectively cool the device.
The ATS-13D-167-C1-R0 is a highly efficient and reliable heat sink that can be used in a variety of applications. Its application fields range from aerospace and automotive to consumer electronics and industrial components. In addition, its working principle relies on conduction, convection, and radiative cooling, making it ideal for cooling high-power, high-heat density devices.
The specific data is subject to PDF, and the above content is for reference