| Allicdata Part #: | ATS-13D-170-C1-R0-ND |
| Manufacturer Part#: |
ATS-13D-170-C1-R0 |
| Price: | $ 3.35 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13D-170-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.04353 |
| 30 +: | $ 2.96100 |
| 50 +: | $ 2.79657 |
| 100 +: | $ 2.63208 |
| 250 +: | $ 2.46758 |
| 500 +: | $ 2.38533 |
| 1000 +: | $ 2.13857 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.02°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is a critical part of product performance and reliability. Heat affects the quality and performance of many types of electronics and components, and thermal management products, such as heat sinks, are essential for improved performance. The ATS-13D-170-C1-R0 is a heat sink designed to efficiently manage heat in a variety of applications.
The ATS-13D-170-C1-R0 is a two-piece, lightweight and high-performance heat sink. Its two-piece construction offers superior thermal performance and efficient thermal management. Its low profile design fits into tight spaces, and its lightweight aluminum construction makes it easy to install. It features a fin shape that creates a removably compact package with quick heat dispersion. The fins are also curved to prevent air from being trapped in the corners as well as to maximize the efficiency of heat dissipation.
The ATS-13D-170-C1-R0 is a reliable thermal solution for a range of applications. Its compact design makes it suitable for use in tight spaces, such as electronic circuit boards and cabinets. It can also be used in other industries such as medical and telecommunications. Its lightweight construction and efficient thermal management make it the perfect choice for high power and high temperature applications.
The ATS-13D-170-C1-R0 works through the principle of convection cooling. In convection cooling, warm air rises away from the surface of the heat sink, carrying heat away from components and into the ambient environment. This process is enhanced by the curved fins of the ATS-13D-170-C1-R0, which direct the flow of air and maximize heat dissipation.
The ATS-13D-170-C1-R0 is an ideal choice for thermal management in a wide range of applications. Its lightweight construction, efficient thermal management, and compact design make it the perfect choice for applications where space is limited and heat must be effectively managed. Its curved fins ensure maximum heat transfer efficiency and its two-piece construction makes it easy to assemble and mount, making it the perfect choice for efficient thermal solutions.
The specific data is subject to PDF, and the above content is for reference