| Allicdata Part #: | ATS-13D-181-C1-R0-ND |
| Manufacturer Part#: |
ATS-13D-181-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13D-181-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are devices designed to transfer thermal energy from one medium to another through thermal conduction. Heat sinks can be found in many different forms, ranging from fan-cooled compact enclosures to large plate fin blocks, and are commonly used in a wide variety of electronic products. ATS-13D-181-C1-R0 is one such type of heat sink, specifically designed to provide effective heat transfer and cooling for electronic components in industrial and commercial applications.
The ATS-13D-181-C1-R0 heat sink is constructed of aluminum alloy with a mounting plate which can be attached to an aluminum or other non-conductive surface. The mounting plate consists of a two-fold design, consisting of an inner and an outer plate that are securely connected by a series of bolts or screws. ATS-13D-181-C1-R0 has an impressive thermal mass for its size, with a large surface area and a thickness of 18mm. The outer profile of the heat sink offers an aerodynamic design that facilitates air circulation between the heat sinks and surrounding components.
The ATS-13D-181-C1-R0 heat sink utilizes a ‘chimney’ effect to dissipate heat away from the device. This is achieved by using multiple fins with an internal fan that pulls air through the finned structure, cooling the device in the process. Heat transfer takes place as the air is pulled through the device, with the hot air being expelled at the opposite side. As air passes over the fins, it increases the surface area available for thermal transfer, allowing the heat sink to dissipate large amounts of heat quickly and efficiently.
The ATS-13D-181-C1-R0 is an effective thermal management solution for a wide range of industrial and commercial applications. It is suited to applications where space is at a premium and can be used to actively cool components of up to 170 watts. It is commonly used in telecommunications systems, computer boards, audio amplifiers, servers, medical devices and other demanding applications.
The ATS-13D-181-C1-R0 heat sink is an efficient and reliable way to dissipate heat from electronic and mechanical components. Its large surface area and cooling fan make it an ideal solution for a wide range of industrial and commercial applications. It is easy to install and maintain, and can extend the life of electronic components by preventing potential damage due to heat-related failures.
The specific data is subject to PDF, and the above content is for reference