| Allicdata Part #: | ATS-13D-185-C3-R0-ND |
| Manufacturer Part#: |
ATS-13D-185-C3-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13D-185-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.88647 |
| 30 +: | $ 3.67059 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The thermal - heat sinks are designed to help transfer heat away from the hot spots or components. This is done by providing either a conductive or convective interface between the components and the surrounding environment. Heat sinks are commonly used in modern technology, such as computers and electronics, to maintain adequate operating temperatures for the components.
ATS-13D-185-C3-R0 is a type of thermal - heat sink is capable of dissipating large amounts of heat from a variety of components. This type of heat sink is made from aluminum that has a copper core and is designed as a fan-less solution that is capable of dissipating large amounts of heat without the need for an external fan. The ATS-13D-185-C3-R0 heat sink has a 185 mm width, a 130 mm depth, and a 30 mm height.
Application Field and Working Principle of ATS-13D-185-C3-R0
The ATS-13D-185-C3-R0 heat sink is mainly used in electronics and computing applications. It is designed to dissipate up to 20 Watts of heat and is suitable for a wide range of applications including microprocessors, graphics cards, and other heat-sensitive components. It is also known to be an effective cooling solution for large-scale servers.
The ATS-13D-185-C3-R0 Thermal – Heat Sink works by using thermal conduit, which is a material with very high thermal conductivity, in order to dissipate heat away from the components. The aluminum basis of the heat sink has the copper core which is how the heat is dispersed. Heat is drawn away from the component via the copper core, is then guided to the outside of the heat sink, and is then dispersed into the environment. The fanless heat sink technology is effective in cooling components without the need for noisy fans that may cause other disturbances.
The ATS-13D-185-C3-R0 is a reliable and affordable cooling solution for various components. Additionally, the heat sink comes with four mounting points that allow for easy installation. It is also lightweight and requires minimal maintenance to keep it working correctly.
In conclusion, the ATS-13D-185-C3-R0 Thermal – Heat Sink is an efficient and reliable cooling solution for a variety of electronics and computing applications. It uses thermal conduit to draw heat away from the hot spot or component and disperses it into the surrounding environment. The heat sink is designed with an aluminum basis and copper core to provide a fanless cooling solution that does not require the use of noisy and annoying fans. The heat sink also comes with four easy-to-install mounting points and is a lightweight solution that requires minimal maintenance.
The specific data is subject to PDF, and the above content is for reference