ATS-13D-190-C2-R0

A heat sinks is a device primarily used for transferring thermal energy from one point in a system to another, generally used in computers, and other electrical based appliances. The ATS-13D-190-C2-R0, a type of heat sink, is a component that typically has a copper or aluminum base with fins placed on the base. This type of heat sink is used inside computers, server racks, and other electrical appliances that generate heat and need to dissipate it away from the hardware component.

The ATS-13D-190-C2-R0 is designed primarily for transferring thermal energy from the surface of a source component to a second surface component, or to ambient air. This type of heat sink is made of an aluminum base which is composed of aluminum-titanium alloy. It also has extruded fangs and taller fins (about 18mm in height), which increase its heat dissipation capabilities. Additionally, this heat sink comes with a versatile motherboard mounting clip, which allows easy installation with most motherboard models.

The ATS-13D-190-C2-R0\'s application field includes the use of computers, networking devices, servers, and other electrical appliances. Such devices create heat due to their electronics and processing capabilities, and this heat needs to be dissipated to avoid permanent damage to the components. The heat can be dissipated by enclosing them in a thermal enclosure, or by using an ATS-13D-190-C2-R0 type of heat sink. This dissipates the thermal energy away from the area by transferring it to ambient air.

The working principle of the ATS-13D-190-C2-R0 is based on the principle of thermal conduction. It takes advantage of the thermal conductivity of the aluminum-titanium alloy, which is also present in its base. The heat generated from the source component is transferred to the fins of the heat sink, which in turn dissipate the heat to their surrounding environment. This type of heat sink has larger and taller fins than other heat sinks, making it more effective in dissipating the heat.

The ATS-13D-190-C2-R0 is a high-performance thermal solution for dissipating heat away from a range of electrical components. It is designed to work with the most recent motherboards and is an efficient solution for dissipating heat from the most demanding application areas. This heat sink comes with mounting clips that make it convenient to install, and it has large fins, capable of dissipating more heat than other heat sinks.

In summary, the ATS-13D-190-C2-R0 is a type of heat sink that is designed primarily to dissipate thermal energy from the surface of a source component to another or to ambient air. It works on the principle of thermal conduction, taking advantage of the thermal conductivity of the aluminum-titanium alloy, and it is particularly useful dissipating heat from computers, servers, and other electrical appliances. With its mounting clips, larger fins, and effective heat transfer technology, the ATS-13D-190-C2-R0 is an ideal and efficient thermal solution.