| Allicdata Part #: | ATS-13D-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-13D-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13D-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions often involve utilizing heat sinks, both in terms of quick and efficient heat distribution as well as practical and effective thermal resistance. One such thermal management device is the ATS-13D-20-C3-R0, and this article will discuss its application field and its working principle.
The ATS-13D-20-C3-R0 is a passive heat sink designed for use with standard thermal modules, such as those which are fitted to computer systems and embedded devices. It has a straight-forward yet effective design, with a simple internal layout comprising of a heat-absorbing copper base and four heat-conducting aluminum fins. This design allows it to efficiently draw heat away from its source, be it an integrated device or the exhaust heat of a power-hungry CPU.
The ATS-13D-20-C3-R0 is especially suitable for use in embedded and power-efficient systems, as its main purpose is to reduce the rate of heat accumulation and to increase heat conduction. The combination of the copper base and aluminum fins creates a high thermal resistance, which can ensure that the heat is efficiently removed from its source and dissipated to the surrounding environment. The design of the aluminum fins allows for an increased rate of heat transfer from the fin surfaces to the external air, and this effectively helps to keep the temperatures of the integrated components low.
Aside from its high thermal resistance, the ATS-13D-20-C3-R0 also offers a number of other advantages. The copper base is designed to be compatible with a wide range of thermal modules, while the aluminum fins provide enough cooling surface for a smooth flow of air. The device also has built-in rigidity and elasticity, which can help ensure that it operates effectively regardless of the user\'s installation environment. Moreover, with its low profile design, it can be conveniently paired with other thermal management solutions to achieve a higher overall cooling effect.
To sum up, the ATS-13D-20-C3-R0 is a thermal management solution designed specifically for use with standard thermal modules. It has a simple but effective design with a copper base and four heat-conducting aluminum fins. This design provides a high thermal resistance, allowing for effective heat dissipation. Moreover, it can be paired with other thermal management solutions to further increase cooling efficiency. All in all, the ATS-13D-20-C3-R0 is a versatile and efficient solution for managing the heat emissions of integrated devices and power-hungry CPUs.
The specific data is subject to PDF, and the above content is for reference