ATS-13D-29-C1-R0

Thermal management is an important element of successful application of any electronic component. Heat sinks play a crucial role in enabling components to function at their optimal level while also preserving their structural integrity. ATS-13D-29-C1-R0 is a type of heat sink used to meet the thermodynamic demands of any electronic system. This article provides an overview of the application field and working principle of ATS-13D-29-C1-R0.

Application Field

The ATS-13D-29-C1-R0 is designed for applications needing to dissipate between 0.25W and 3W of heat. This is a mid-level range of thermal dissipation, making this heat sink an ideal solution for smaller applications such as consumer electronics, computers, and telecommunications equipment. Its small size also allows for convenient installation into tight spaces.

The ATS-13D-29-C1-R0 is built with a copper core and is clad in aluminum. This combination of materials enables the heat sink to provide great thermal conductivity while still having good structural integrity. It also means that the heat sink is capable of withstanding temperatures in the range of -55°C~125°C. These features make the ATS-13D-29-C1-R0 a reliable heat sink for a wide variety of thermally challenging applications.

Working Principle

Heat sinks are a type of passive cooling technology that rely on the physical properties of the specific material used to dissipate heat. In the case of the ATS-13D-29-C1-R0, the heat sink is designed to absorb heat through its base and dissipate it away from the device. This is accomplished through the combination of the copper core and aluminum cladding. Copper has a higher thermal conductivity than aluminum, so the copper core is able to quickly absorb the heat from the device and spread it across the heat sink. The aluminum cladding then serves to dissipate the heat away from the device and into the ambient environment.

The ATS-13D-29-C1-R0 is designed with a series of “fins” that are engineered in such a way as to increase the total surface area of the heat sink. This is done in order to maximize the amount of heat-dissipation surface that is in contact with the ambient air. The larger the surface area, the more efficiently the heat can be dissipated into the environment. Additionally, the fins are curved in such a way as to promote air flow over the heat sink, which further helps to dissipate heat faster.

Conclusion

The ATS-13D-29-C1-R0 is an ideal thermal management device for a range of applications, especially those with tight spaces or mid-level thermal demands. Its Aluminum-clad copper design makes it a reliable solution, with the ability to dissipate heat quickly and efficiently. The fins also work to increase the heat-dissipation surface area of the device to increase the rate of heat dissipation. The ATS-13D-29-C1-R0 is a great heat sink device with a wide range of application options.