| Allicdata Part #: | ATS-13D-40-C1-R0-ND |
| Manufacturer Part#: |
ATS-13D-40-C1-R0 |
| Price: | $ 5.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X11.43MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13D-40-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.26302 |
| 30 +: | $ 4.97049 |
| 50 +: | $ 4.67813 |
| 100 +: | $ 4.38575 |
| 250 +: | $ 4.09336 |
| 500 +: | $ 3.80098 |
| 1000 +: | $ 3.72789 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.55°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks play an important role when it comes to managing the heat generated by electronic devices. This is especially true of ATS-13D-40-C1-R0, a highly efficient thermal heat sink that allows customers to maximize their cooling needs. It is widely used in many applications due to its ability to dissipate heat quickly and efficiently.
ATS-13D-40-C1-R0 is an aluminum-copper alloy thermal sink with a base plate, heat spreader, and air router. It has an anodic oxidation coating, which is an abbreviation for the chemical salt solution used in the process of coating the device in order to prevent corrosion. The high thermal conductivity and efficient heat dissipation of the alloy material make it an ideal choice for cooling high-heat electronic components.
The working principle of ATS-13D-40-C1-R0 is relatively simple yet highly effective. It relies on the concept of conduction to transfer heat between two objects. Conduction occurs when the molecules of one object vibrate and cause a transfer of energy to the molecules of the adjacent objects. In the case of ATS-13D-40-C1-R0, the heat from the electronic component is transferred to the surface of the heat sink and distributed via the fins, allowing for rapid cooling.
The wide area of application of ATS-13D-40-C1-R0 makes it popular among many different industries. It is commonly used in automobiles, computers, and other electronic devices. It is also widely used in industrial production applications, such as cooling machine components. In addition, ATS-13D-40-C1-R0 is ideal for cooling high-powered laser applications.
The excellent thermal performance of ATS-13D-40-C1-R0 makes it a great choice for businesses and organizations looking to maximize their cooling needs. Its high thermal performance and ability to dissipate heat quickly and efficiently make it one of the most reliable and effective thermal solutions on the market today.
The specific data is subject to PDF, and the above content is for reference