ATS-13D-41-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	2.280" (57.90mm)
Width:	2.400" (60.96mm)
Diameter:	--
Height Off Base (Height of Fin):	0.700" (17.78mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.03°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to ATS-13D-41-C2-R0 Thermal - Heat Sinks

Thermal - heat sinks are products used to dissipate heat from devices such as computers and other electronic devices. The ATS-13D-41-C2-R0 thermal - heat sink is a product of ATE Electronics, a global technology leader in the design and manufacture of high-quality thermal solutions. This device or product is designed to remove heat from components, facilitate the flow of air through the system, and keep the components running at an acceptable performance level.

ATS-13D-41-C2-R0 Application Field

ATS-13D-41-C2-R0 thermal-heat sink is ideal for use in a variety of sectors, such as computer, automotive, and industrial. Its application field includes but not limited to:

• Computer applications: in computers, the ATS-13D-41-C2-R0 is used to remove heat from microprocessors, video cards, audio cards, and hard drives.
• Automotive applications: commonly used in engine controls that require powerful coolants to maintain internal temperatures of cars.
• Industrial applications: often used in industrial automation, robotics, aerospace and other industries.

ATS-13D-41-C2-R0 Working Principle

Mechanically speaking, a heat sink is an electronic component that is designed to dissipate heat from a device or system. The heat sink functions by absorbing and dispersing heat away from the device or system. To achieve its purpose, the ATD-13D-41-C2-R0 thermal-heat sink utilizes a combination of materials and design components to effectively funnel heat away from the system. The conduction method is used to transfer the heat through the use of metal or graphite absorbed by the element, thus absorbing and dispersing the heat away from the device.The design consists of two parts working in tandem to effectively dissipate heat. The thermal base is the interface between the device or system and the heat sink. It keeps the components cooled by providing a flat surface for the thermal transfer. On the other hand, the thermal body (thermal fins) take in heat and further increases thermal dissipation with its large surface area fins.The fan attached to the ATS-13D-41-C2-R0 acts as a way to maintain the temperature of the components. It works by taking in the air and creating the flow of the air inside the device or system. The flow of the air helps in the ventilation of the components and limits their temperature rise.

Conclusion

The ATS-13D-41-C2-R0 thermal-heat sink is an effective device for managing heat in a variety of systems. Its ability to dissipate heat is useful in protecting components from damage due to excessive heat. In addition, its fan and airflow make it a valuable asset in keeping temperatures within acceptable limits. It is suitable for a variety of applications, such as computers, automotive, and industrial.

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