ATS-13D-54-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-13D-54-C3-R0-ND

Manufacturer Part#:

ATS-13D-54-C3-R0

Price: $ 4.07
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X35MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13D-54-C3-R0 datasheetATS-13D-54-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.68991
30 +: $ 3.48474
50 +: $ 3.27978
100 +: $ 3.07484
250 +: $ 2.86985
500 +: $ 2.66487
1000 +: $ 2.61362
Stock 1000Can Ship Immediately
$ 4.07
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.19°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-13D-54-C3-R0 is a component used in the field of thermal management, specifically in relation to heat sinks. Heat sinks are used to dissipate heat from components of a system, such as processors and other integrated circuits, so as not to cause them to overheat and fail. The fundamental principle of a heat sink is its ability to absorb and transfer heat away from the components it is designed to protect.

In terms of the ATS-13D-54-C3-R0\'s application field, it is commonly used for computer thermal management. This is because computer components, such as processors, graphics cards, and smaller electronic components, generate large amounts of heat. The ATS-13D-54-C3-R0 heat sink is designed to be a flat, thermally conductive component that is capable of dissipating heat away from these components. This can thus extend the life of the computer components, protect them from damage, and help reduce the overall temperatures of the computer system.

In terms of the thermal principles that the ATS-13D-54-C3-R0 works on, it uses thermally conductive technology. This technology is designed to efficiently dissipate heat away from the component by thermal conduction. This technology is implemented by having a flat surface area, which allows the heat from the component to spread out and be absorbed by the heat sink. The heat is then dissipated away from the component into the environment via a fan or other cooling component.

The thermally conductive technology used in the ATS-13D-54-C3-R0 is also enhanced by the use of heat pipes. Heat pipes are small tubing filled with a thermally-conductive material, such as water or air, and serve to transfer heat away from the component. The heat pipe is attached to the component, and when the component is heated up, the pipes transfer the heat away from the component, allowing for more efficient cooling. This process is enhanced by the use of a fan, which increases the airflow across the heat pipes and helps to dissipate the heat away from the component.

In addition to the heat sink itself, the ATS-13D-54-C3-R0 heat sink also includes a heatsink fan. This fan serves to increase the amount of airflow across the heat sink, which helps to dissipate the heat away from the component. The fan also serves to reduce the noise generated by the heat sink, allowing for a more quiet working environment. The fan also functions to reduce the overall temperature of the system, allowing the components to run cooler and more efficiently.

Overall, the ATS-13D-54-C3-R0 heat sink is an effective tool for preventing computer components from suffering the effects of overheating. Its thermally conductive technology, along with its heat pipes and fan, serves to efficiently dissipate the heat away from the component, allowing for longer component life and more efficient cooling. In this way, the ATS-13D-54-C3-R0 can help to keep computer systems running cooler and more efficiently for longer periods of time.

The specific data is subject to PDF, and the above content is for reference

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