
Allicdata Part #: | ATS22406-ND |
Manufacturer Part#: |
ATS-13D-65-C2-R0 |
Price: | $ 4.81 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 40X40X30MM L-TAB T766 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | $ 4.37220 |
10 +: | $ 4.25628 |
25 +: | $ 4.02016 |
50 +: | $ 3.78365 |
100 +: | $ 3.54715 |
250 +: | $ 3.31068 |
500 +: | $ 3.07420 |
1000 +: | $ 3.01508 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.575" (40.00mm) |
Width: | 1.575" (40.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.181" (30.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 7.29°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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The ATS-13D-65-C2-R0 is a type of thermal-heat sink that is commonly used in a variety of applications. This particular thermal-heat sink is designed to dissipate heat and keep components running at cooler temperatures. Heat sinks are essential components of any system that requires cooling as they help draw the heat away from the system and disperse it in a safe manner.
This particular type of thermal-heat sink is designed specifically for use in high power, high performance applications. It has a robust construction and is capable of dissipating up to 65 Watts of power. Its design is also optimized for use in confined spaces, allowing it to be mounted in places where other thermal-heat sinks may not fit.
The ATS-13D-65-C2-R0 is a two-part cooling system. The first part of the system comprises of a finned aluminum heat sink that is designed to absorb and dissipate heat. The finned aluminum heat sink is placed on top of a fan that helps to circulate air around the heat sink. The fan helps to keep the fins of the heat sink cooler by drawing air from the area and blowing it over the fins.
The second part of the system is the thermal interface material. This material, which is applied between the heat sink and the component to be cooled, helps to form an effective thermal bridge between the two. The thermal interface material helps to evenly dissipate the heat from the component and ensures that there are no ‘hot spots’ in which the heat accumulates and reduces the efficiency of the component.
In order to ensure the best possible performance, the ATS-13D-65-C2-R0 should be used in conjunction with effective airflow management. By ensuring that the fan is set at an appropriate speed, the temperature of the components can be controlled and any potential hot spots can be avoided. Additionally, the installation of additional fans can help speed up the cooling process and thus improve the performance of the system as a whole.
The ATS-13D-65-C2-R0 is a versatile thermal-heat sink that can be used in a variety of applications. As well as dissipating 65 Watts of power, it is suitable for use in high performance applications and also for use in confined spaces. It is a reliable and effective way of keeping components running at cooler temperatures and helps to increase the efficiency and longevity of the components.
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