ATS-13D-67-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	20.39°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-13D-67-C3-R0 is a thermal heat sink device that is well suited for cooling electronic components. It consists of an aluminium alloy heat spreader plate, which is mounted on a copper finned cold plate. The cold plate and the heat spreader plate are connected together by heat pipes or flexible tube connections, so as to transfer heat from the components to the heat sink. The ATS-13D-67-C3-R0 is designed to offer high performance cooling at a very low weight, making it ideal for a number of different applications.

Application Field

The ATS-13D-67-C3-R0 is usually used in environments where heat transfer is critical. It is especially beneficial in applications where a compact solution is required. The ATS-13D-67-C3-R0 is most commonly used in applications such as power modules, computers, telecommunications, refrigeration, industrial controllers, medical devices and more. It is suitable for both commercial and industrial applications, and can be used to cool processors, electronic components and other power circuits.The ATS-13D-67-C3-R0 is also ideal for applications where space is at a premium. Its slim design makes it ideal for use in tight spots, as it has a much smaller footprint than many other thermal solutions.

Working Principle

The ATS-13D-67-C3-R0 is designed to be an effective thermal heat sink solution. Its design allows it to perform optimally in both indoor and outdoor applications. Its aluminium alloy heat spreader plate is able to disperse heat quickly and efficiently from the device, while the copper finned cold plate is able to absorb heat and dissipate it into the surrounding environment.Heat pipes are used to transfer heat from the heat source to the cold plate. Heat pipes are used because they are very efficient, enabling heat to be transferred quickly and with minimal losses. Heat transfers from the heat source to the heat pipes via a thermal interface material. This material is designed to provide thermal interface between the heat source and the heat pipes.The heat spreader plate disperses the heat from the heat pipes, while the copper fins of the cold plate absorb and dissipate the heat into the surrounding environment. Thecold plate is usually made up of a series of parallel-arranged flat plates. These plates are arranged to allow for air to easily move through them. This maximises the dissipation of heat into the surrounding environment, while also reducing power consumption.

Conclusion

The ATS-13D-67-C3-R0 is a thermal heat sink device that offers high efficacy cooling with minimal weight. It is designed to be used in tight spaces, allowing it to be used in a variety of applications. Its slim design and efficient thermal interface make it ideal for cooling sensitive electronic components. Its working principle is based on the use of aluminium alloy heat spreaders, heat pipes and copper finned cold plates, enabling the efficient transfer of heat to the environment.

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