| Allicdata Part #: | ATS-13D-74-C3-R0-ND |
| Manufacturer Part#: |
ATS-13D-74-C3-R0 |
| Price: | $ 3.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13D-74-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.07881 |
| 30 +: | $ 2.99586 |
| 50 +: | $ 2.82933 |
| 100 +: | $ 2.66295 |
| 250 +: | $ 2.49652 |
| 500 +: | $ 2.41329 |
| 1000 +: | $ 2.16364 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.62°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The Thermal - Heat Sinks family of products plays a major role in thermal management of electronic components in situations that require cooling solutions. ATS-13D-74-C3-R0 thermal heat sink is a multi-plate aluminum panel made up of stacked plates with a low-distortion frame and embedded conductive layers. It is capable of blowing a large amount of air into a confined space to dissipate heat quickly. This helps regulate the internal temperature of the components to prevent them from over-heating and improve their performance.A unique feature of the ATS-13D-74-C3-R0 is that it is designed with a ventilation system which allows air to circulate more freely in and around the heatsink allowing it to dissipate more heat. In addition, it comes with a unique fan design that creates airflow in both directions, providing most efficient use of its surface area. The fan also operates at an adjustable speed, depending on the cooling requirements of the components.The ATS-13D-74-C3-R0 is suitable for applications in a variety of industries including automotive, medical electronics, communications, industrial equipment, and home appliances. It is typically used in high temperature, high-performance applications where components need to be kept cool. As such, it is an ideal solution for cooling high-power LED devices or CPU, GPU, RAM, and other semiconductor components.The ATS-13D-74-C3-R0 thermal heat sink functions through the principles of convection and conduction. Through convection, air passes over the outer surface of the heat sink and absorbs heat. Then this heat is conducted downwards from the top of the heat sink to the bottom. The internal structure of the heatsink is engineered to control air flow and optimize its heat dissipation.The ATS-13D-74-C3-R0 thermal heat sink is not only capable of cooling the components, but also offers a significant life time performance and good reliability. It provides a highly efficient thermal management solution for your electronic system. The multi-plate design also allows you to easily replace the inner and outer components to upgrade its performance without having to remove and install a completely new heat sink.In conclusion, the ATS-13D-74-C3-R0 thermal heat sink is a high-quality, cost-effective cooling solution and is ideal for applications in a variety of industries. It offers quick and efficient heat dissipation using its unique multi-plate design and adjustable fan speed. Additionally, its long-term reliability and efficiency make it a great choice for cooling high-power LED devices, CPUs, GPUs, memory and other semiconductor components.
The specific data is subject to PDF, and the above content is for reference