ATS-13D-89-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS22430-ND

Manufacturer Part#:

ATS-13D-89-C2-R0

Price: $ 4.56
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X30MM R-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13D-89-C2-R0 datasheetATS-13D-89-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 4.13910
10 +: $ 4.02507
25 +: $ 3.80167
50 +: $ 3.57802
100 +: $ 3.35437
250 +: $ 3.13075
500 +: $ 2.90712
1000 +: $ 2.85122
Stock 1000Can Ship Immediately
$ 4.56
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.94°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are a crucial element in technology products ranging from consumer laptops and gaming consoles to industrial equipment like control systems and Wi-Fi base stations. Heat sinks help keep electronics from overheating and potentially damaging the device. Heat is removed from hot components and dissipated into the ambient air surrounding the device, ensuring that it is kept cool. The ATS-13D-89-C2-R0 thermal heat sink is a crucial component in a range of technology products.

The ATS-13D-89-C2-R0 is a high-performance aluminum-clad heat sink with a ferritic-plated finish. It features a rugged construction and superior thermal performance. It is designed to dissipate heat quickly and efficiently. The ATS-13D-89-C2-R0 has excellent thermal conductivity, which ensures that the device it is attached to stays cool, even under heavy load. The ATS-13D-89-C2-R0 is designed with multiple fins that increase the surface area and enhance its ability to dissipate heat.

The ATS-13D-89-C2-R0 is made of a rugged aluminum alloy and designed to provide reliable and efficient heat dissipation. The fins are designed to maximize surface area, allowing the heat sink to dissipate more heat. The ATS-13D-89-C2-R0 is also designed with an array of mounting holes in order to attach it securely to the device it is attached to. This ensures that the heat sink is securely mounted to the device and won\'t become detached due to vibrations or changes in temperature. The mounting holes also ensure that the heat sink is mounted at the correct height so as to maximize its thermal efficiency.

The working principle of the ATS-13D-89-C2-R0 is simple yet effective. Heat is drawn away from the device it is attached to and dissipated into the surrounding environment. Heat is often drawn away from these devices via a heat pipe. Heat pipes are narrow tubes that contain a fluid that radiates heat as it passes through the pipe. The fluid in the heat pipe then carries the heat away from the device and to the heat sink, where it is quickly and efficiently dispersed.

The ATS-13D-89-C2-R0 has a wide variety of applications. It is used in industrial equipment including control systems, medical equipment, Wi-Fi base stations, and high-end printing machinery. It is also used in consumer electronics like laptop computers, tablets, gaming consoles, and home media systems. The ATS-13D-89-C2-R0 ensures that these devices stay cool and running at optimal performance despite heavy use.

The ATS-13D-89-C2-R0 thermal heat sink is an essential component of today\'s technology products. It is designed to dissipate heat and ensure that these devices stay cool. The ATS-13D-89-C2-R0 is rugged and reliable, featuring multiple fins to maximize its thermal performance. It is an ideal choice for home and industrial electronics, providing reliable and efficient heat dissipation so that these devices can run at optimal performance.

The specific data is subject to PDF, and the above content is for reference

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