| Allicdata Part #: | ATS22436-ND |
| Manufacturer Part#: |
ATS-13D-95-C2-R0 |
| Price: | $ 4.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13D-95-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.37220 |
| 10 +: | $ 4.25628 |
| 25 +: | $ 4.02016 |
| 50 +: | $ 3.78365 |
| 100 +: | $ 3.54715 |
| 250 +: | $ 3.31068 |
| 500 +: | $ 3.07420 |
| 1000 +: | $ 3.01508 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are devices that are designed to absorb large amounts of heat from hot objects at a fast rate. Heat sinks are essential components in electronics, computers, and other electronic equipment as they help to dissipate the heat created by the product’s operation in order to maintain its proper functioning. The ATS-13D-95-C2-R0 is a high-performance heat sink designed to specifically address the needs of modern electronics.
Application Field
The ATS-13D-95-C2-R0 heat sink is well-suited for use in a variety of applications, including servers, network infrastructure, and medical equipment. Its low-profile, lightweight design makes it a great choice where space is limited, making it ideal for use in smaller rooms and confined spaces. Additionally, its high thermal conductivity and low thermal resistance make it an efficient solution for dissipating large amounts of heat.
Working Principle
The basic concept behind heat sinks is to transfer thermal energy from a hot object to a cooler object using a material that has a high thermal conductivity. This is accomplished by making sure that the surface of the heat sink is in direct contact with the hot surface, ensuring maximum heat transfer efficiency. The ATS-13D-95-C2-R0 uses a combination of fins and channels to disperse the heat throughout the heat sink for quick and efficient cooling.
The design of the ATS-13D-95-C2-R0 heat sink also provides excellent rigidity, preventing any unnecessary bending or deformation under larger loads. Additionally, it can accommodate multiple fan configurations for added cooling capacity or for the purpose of noise reduction. Its fan compatibility also further increases its popularity with medical and industrial equipment designers where operational noise levels need to be kept to a minimum.
Overall, the ATS-13D-95-C2-R0 heat sink is an efficient and reliable method of dissipating large amounts of heat from delicate electronics. Its high thermal conductivity, low thermal resistance, and compact design make it an ideal choice for a wide range of applications, from servers and industrial machines to medical and network infrastructure systems.
The specific data is subject to PDF, and the above content is for reference