| Allicdata Part #: | ATS-13E-02-C1-R0-ND |
| Manufacturer Part#: |
ATS-13E-02-C1-R0 |
| Price: | $ 3.20 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13E-02-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.91249 |
| 30 +: | $ 2.83395 |
| 50 +: | $ 2.67649 |
| 100 +: | $ 2.51899 |
| 250 +: | $ 2.36157 |
| 500 +: | $ 2.28284 |
| 1000 +: | $ 2.04668 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-heat sink technology is a combination of heat transfer and heat dissipation. ATS-13E-02-C1-R0 is a type of thermal-heat sink that takes advantage of this technology. By using heat energy in the environment, this thermal-heat sink is able to reduce operation costs for electronic equipment that require cooling.
The ATS-13E-02-C1-R0 is composed of two parts: a heat transfer device and a heat dissipating device. The heat transfer device is designed to absorb and distribute heat energy to the heat dissipating device. This allows for maximum efficiency in dissipating heat from the equipment.
The heat dissipating device includes a series of fins mounted in a circular array around the base of the heat sink. The fins increase the surface area exposed to the air, allowing the heat to dissipate quickly and evenly. The fins also draw in warmer air from around the equipment, giving the heat sink the ability to cool down faster.
The heat transfer device is used to transfer the heat from the equipment to the environment. In the ATS-13E-02-C1-R0, the heat transfer device employs a special thermal conduction mechanism that helps transfer the heat from the equipment. The heat transfer device also helps maintain a constant temperature in the equipment, thereby helping to reduce its operating costs.
The working principle of the ATS-13E-02-C1-R0 is fairly simple. It uses conduction to transfer the heat from the equipment to the air. The heat dissipating device helps dissipate the heat into the air much faster and more efficiently than would be possible on its own.
The ATS-13E-02-C1-R0 has several advantages over traditional cooling systems. It is much cheaper than other cooling systems and is energy efficient because it does not require additional electricity to operate. In addition, it does not produce any noise, making it attractive for use in environments requiring silent operation.
The main application field of the ATS-13E-02-C1-R0 is in electronics. It is commonly used in computers, servers, and various other electronic devices to help control their temperatures and increase their reliability. The ATS-13E-02-C1-R0 is also used in medical devices and industrial applications, where it aids in the production of precision components and displays.
The ATS-13E-02-C1-R0 is a reliable and cost effective solution for electronic and industrial cooling applications. Its working principle of conduction enables the heat sink to transfer heat from components quickly and reliably, while its high-performance fins enable it to dissipate heat into the environment much faster than traditional cooling systems.
The specific data is subject to PDF, and the above content is for reference