| Allicdata Part #: | ATS-13E-11-C3-R0-ND |
| Manufacturer Part#: |
ATS-13E-11-C3-R0 |
| Price: | $ 3.83 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13E-11-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.48138 |
| 30 +: | $ 3.28818 |
| 50 +: | $ 3.09481 |
| 100 +: | $ 2.90134 |
| 250 +: | $ 2.70791 |
| 500 +: | $ 2.51449 |
| 1000 +: | $ 2.46614 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.86°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks, also known as heat conduction assemblies, are essential for processor heat dissipation. As semiconductor chips become faster, their need for cooling increases. The ATS-13E-11-C3-R0 is a high-performance, advanced-technology heat sink that is designed to dissipate heat produced from high power applications.
The ATS-13E-11-C3-R0 employs a low- to mid-temperature range conduction fin system suitable for use in the most demanding thermal environments. The thermal heat sink uses a customizable combination of bonding, extruded, or stamped fins that allows for quick and easy installation in the end-user’s device. This thermal heat sink is designed with two separate machining processes. The first machining process is used for the base and the second machining process is used for the fins. Both processes create a smooth, level surface that significantly improves the ability to transfer heat.
The ATS-13E-11-C3-R0 is capable of dissipating large amounts of thermal energy at high temperatures. The device is built with a thermal resistance of 0.0028º C/W-m2 and a minimum thermal energy transfer of 0.037 W/C-m2. This allows the device to perform optimally under most thermal conditions.
The material used in the construction of the ATS-13E-11-C3-R0 is aluminum, which makes it lightweight and robust. Aluminum has excellent thermal conductivity, making it ideal for dissipating heat generated by processors. Additionally, aluminum is highly resistant to corrosion, which means it will be able to handle environmentally hostile conditions.
The ATS-13E-11-C3-R0 is ideal for applications where heat dissipation is essential for optimal performance. The device has been designed for use in a wide range of applications such as automotive electronics, high-temperature components, and gaming consoles and can easily be integrated into these systems. This thermal heat sink is also easily integrated into many industrial-grade processor solutions through the use of custom mounting kits.
The ATS-13E-11-C3-R0 is designed to be flexible and easy to install. The device comes with pre-drilled holes for easy mounting, and the installation process is simple and straightforward. The thermal heat sink is designed to be durable and reliable, which allows it to handle long-term use in most thermal environments.
In summary, the ATS-13E-11-C3-R0 is a powerful and reliable thermal heat sink that is designed for applications where heat dissipation is essential for optimal performance. The device is constructed from lightweight aluminum and comes with pre-drilled mounting holes for easy installation. The thermal heat sink is capable of dissipating large amounts of thermal energy at high temperatures, and its high-level of thermal conductivity makes it suited for use in a variety of applications. Due to its flexibility and reliability, the ATS-13E-11-C3-R0 is a versatile and reliable thermal heat sink solution.
The specific data is subject to PDF, and the above content is for reference