ATS-13E-117-C1-R0

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Heat Sinks are an important part of our everyday lives. They are used to protect electronic components from becoming too hot, thus avoiding damage. The ATS-13E-117-C1-R0 heat sink is a unique and highly reliable product that is used in a wide variety of applications.

The ATS-13E-117-C1-R0 is generally used for cooling of components in space-constrained areas where there is insufficient room for regular air cooling methods. The thermal exchange of heat between the heat sink and the surrounding environment is achieved by the use of conduction and fins. The fins work by extending the surface area of the heat sink for better heat transfer to the environment. The fins also help to increase air flow to further dissipate heat from the base plate of the heat sink.

The ATS-13E-117-C1-R0 provides efficient thermal performance for a fraction of the cost of traditional air cooling systems. The heat sink features a copper-based base plate with a high thermal conductivity that allows for fast heat dissipation. The entire heat sink is made from advanced, specially formulated aluminum extrusion, which has excellent durability and corrosion resistance. Additionally, the fins are designed to be highly efficient in heat dissipation, while the metal channels reduce turbulence.

In terms of application, the ATS-13E-117-C1-R0 is most often used to cool components in applications where a traditional air cooling system may not be practical or feasible. This includes high-power and high-temperature applications such as industrial, military, and aerospace operations. The heat sink can also be used for consumer electronics, automotive electronics, and other electronics applications.

In addition to its thermal performance, the ATS-13E-117-C1-R0 also offers a variety of features including a compact foot print, low profile design, and easy installation. Additionally, the heat sink is designed to be highly reliable and performance efficient. The heat sink is also available in various sizes and shapes for best optimization of thermal load in varying applications.

The working principle behind the ATS-13E-117-C1-R0 is fairly straightforward. As mentioned before, the heat sink uses a combination of conduction and fins to effectively dissipate heat from the base plate to the environment. The heat is transferred between the base plate and the fins, after which it is dissipated into the environment through convection. The heat can then be redirected away from the electronic component in order to keep it below its critical operating temperature.

Overall, the ATS-13E-117-C1-R0 provides a great option for cooling various electronics from high-power, high-temperature applications to everyday consumer electronics. The compact design and efficient heat dissipation make it an ideal choice for applications where regular air cooling may not be feasible. Additionally, the heat sink is available in different sizes and shapes to meet the specific requirements of any application.

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